SCHEMBL2363419

SCHEMBL2363419

CCCCCc1ccc2c(c1)C(=O)OC2=O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GPR3 P46089 1/20 0.49
LPL P06858 6/20 0.46
LIPG Q9Y5X9 6/20 0.46
KAT8 Q9H7Z6 2/20 0.43
PPARA Q07869 1/20 0.43
ALDH1A1 P00352 2/20 0.42
TRPV1 Q8NER1 1/20 0.42
MGLL Q99685 1/20 0.42
ESR1 P03372 2/20 0.42
ADRA2A P08913 2/20 0.42
ADORA3 P0DMS8 2/20 0.42
TACR2 P21452 2/20 0.42
SLC6A2 P23975 2/20 0.42
SLC6A4 P31645 2/20 0.42
SLC6A3 Q01959 2/20 0.42
KDM4E B2RXH2 1/20 0.42
LMNA P02545 1/20 0.42
SHBG P04278 1/20 0.42
TP53 P04637 1/20 0.42
CYP3A4 P08684 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6407464 0.98 GPR3 (0.51) GPR3LPLLIPGKAT8PPARA
SCHEMBL28136660 0.98 GPR3 (0.51) GPR3LPLLIPGKAT8PPARA
SCHEMBL2675582 0.98 GPR3 (0.51) GPR3LPLLIPGKAT8PPARA
SCHEMBL6407122 0.98 GPR3 (0.51) GPR3LPLLIPGKAT8PPARA
SCHEMBL8340236 0.98 GPR3 (0.51) GPR3LPLLIPGKAT8PPARA
SCHEMBL8344457 0.98 GPR3 (0.51) GPR3LPLLIPGKAT8PPARA
SCHEMBL6412562 0.95 SKP2 (0.43) GPR3LPLLIPGALDH1A1LMNA
SCHEMBL20251161 0.91 ALOX15 (0.46) GPR3ALDH1A1LMNA
SCHEMBL28730600 0.90 GPR3 (0.45) GPR3LPLLIPGKAT8PPARA
SCHEMBL20251159 0.89 ALOX15 (0.44) GPR3LPLLIPGALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114807916-A Chemical nickel plating solution for wafer and preparation method thereof 江苏矽智半导体科技有限公司 2022-07-29 CN claimed
CN-114807916-A Chemical nickel plating solution for wafer and preparation method thereof 江苏矽智半导体科技有限公司 2022-07-29 CN disclosed
EP-1852392-B1 Method for activating hydrogenation catalyst and method for producing hydrogen peroxide including same MITSUBISHI GAS CHEMICAL CO (JP) 2013-06-05 EP disclosed
EP-1478694-B1 POLYETHERIMIDE COMPOSITION, METHOD, AND ARTICLE SABIC INNOVATIVE PLASTICS IP (NL) 2011-08-10 EP disclosed
US-7833510-B2 Method for activating hydrogenation catalyst and method for producing hydrogen peroxide including same Mitsubishi Gas Chemical Compayn, Inc. (JP) 2010-11-16 US disclosed
US-20080170985-A1 Method for activating hydrogenation catalyst and method for producing hydrogen peroxide including same MITSUBISHI GAS CHEMICAL COMPANY, INC. 2008-07-17 US disclosed
EP-1852392-A1 Method for activating hydrogenation catalyst and method for producing hydrogen peroxide including same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2007-11-07 EP disclosed