Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | PKM | P14618 | 1/20 | 0.39 |
| ▸ | HPGD | P15428 | 1/20 | 0.39 |
| ▸ | GPR84 | Q9NQS5 | 5/20 | 0.37 |
| ▸ | PI4KA | P42356 | 1/20 | 0.35 |
| ▸ | PI4K2B | Q8TCG2 | 1/20 | 0.35 |
| ▸ | PI4K2A | Q9BTU6 | 1/20 | 0.35 |
| ▸ | PI4KB | Q9UBF8 | 1/20 | 0.35 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10766106 | 0.98 | ALDH1A1 (0.41) | ALDH1A1PKMHPGDGPR84PI4KA | |
| Bromide SCHEMBL28958169 | 0.97 | ALDH1A1 (0.40) | ALDH1A1PKMHPGDGPR84PI4KA | |
| SCHEMBL3404044 | 0.95 | HRH3 (0.38) | ALDH1A1PKMHPGDGPR84 | |
| SCHEMBL3405755 | 0.87 | GLA (0.31) | — | |
| SCHEMBL651213 | 0.83 | GPR84 (0.41) | ALDH1A1PKMHPGDGPR84PI4KA | |
| Hydrochloric Acid SCHEMBL12468552 | 0.81 | GPR84 (0.40) | ALDH1A1PKMHPGDGPR84PI4KA | |
| SCHEMBL29882926 | 0.80 | GPR84 (0.30) | GPR84 | |
| SCHEMBL1134128 | 0.80 | — | — | |
| SCHEMBL633213 | 0.77 | HRH3 (0.38) | ALDH1A1PKMHPGDGPR84 | |
| SCHEMBL7712630 | 0.77 | ALDH1A1 (0.37) | ALDH1A1PKMHPGDGPR84PI4KA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7988842-B2 | Continuous copper electroplating method | C. UYEMURA & CO., LTD. (JP) | 2011-08-02 | — | — | US | disclosed |
| US-20090026083-A1 | CONTINUOUS COPPER ELECTROPLATING METHOD | C. UYEMURA & CO., LTD. (JP) | 2009-01-29 | — | — | US | disclosed |
| US-4115124-A | WITH POLYVINYLIMIDAZOLE | EASTMAN KODAK COMPANY (US) | 1978-09-19 | — | — | US | disclosed |