Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 4/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.43 |
| ▸ | NPC1 | O15118 | 1/20 | 0.43 |
| ▸ | LMNA | P02545 | 1/20 | 0.43 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.43 |
| ▸ | RAB9A | P51151 | 1/20 | 0.43 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.43 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.43 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.40 |
| ▸ | CYP2A6 | P11509 | 1/20 | 0.40 |
| ▸ | LTB4R | Q15722 | 2/20 | 0.40 |
| ▸ | LTB4R2 | Q9NPC1 | 2/20 | 0.40 |
| ▸ | TP53 | P04637 | 1/20 | 0.39 |
| ▸ | CSNK2A1 | P68400 | 2/20 | 0.38 |
| ▸ | PDK2 | Q15119 | 1/20 | 0.36 |
| ▸ | PSMB5 | P28074 | 1/20 | 0.35 |
| ▸ | FOLH1 | Q04609 | 1/20 | 0.35 |
| ▸ | BCL2 | P10415 | 1/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.35 |
| ▸ | USP2 | O75604 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28488901 | 0.87 | PSMB5 (0.43) | LTB4RLTB4R2CSNK2A1PDK2PSMB5 | |
| SCHEMBL4860000 | 0.83 | NPC1 (0.47) | MAPTALDH1A1NPC1LMNAMAPK1 | |
| SCHEMBL4508207 | 0.79 | TP53 (0.41) | MAPTALDH1A1NPC1LMNAMAPK1 | |
| SCHEMBL4514411 | 0.78 | HTR7 (0.41) | MAPTALDH1A1NPC1LMNAMAPK1 | |
| SCHEMBL8459740 | 0.77 | MAPT (0.57) | MAPTALDH1A1NPC1LMNAMAPK1 | |
| SCHEMBL258211 | 0.77 | CNR1 (0.43) | MAPTALDH1A1NPC1LMNAMAPK1 | |
| SCHEMBL27887991 | 0.76 | MEN1 (0.42) | MAPTALDH1A1NPC1LMNARAB9A | |
| SCHEMBL8758644 | 0.76 | MEN1 (0.42) | MAPTALDH1A1NPC1LMNARAB9A | |
| SCHEMBL3972895 | 0.75 | TRPA1 (0.41) | MAPTALDH1A1NPC1LMNAMAPK1 | |
| SCHEMBL10520096 | 0.74 | ESR2 (0.55) | MAPTALDH1A1NPC1LMNAMAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117720787-A | Flexible metal clad laminate and method of making the same | 科腾聚合物荷兰有限责任公司 | 2024-03-19 | — | — | CN | disclosed |
| CN-112368311-B | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2023-11-03 | — | — | CN | disclosed |
| CN-112020523-B | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-116056885-A | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2023-05-02 | — | — | CN | disclosed |
| CN-111620982-B | Thermosetting resin composition, and adhesive sheet, metal-clad laminate and printed wiring board produced using same | 南亚新材料科技股份有限公司 | 2023-02-10 | — | — | CN | disclosed |
| CN-114555360-A | Copper-clad laminate, wiring board, and resin-attached copper foil | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| CN-114555357-A | Metal-clad laminate, wiring board, metal foil with resin, and resin composition | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| CN-114423602-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-04-29 | — | — | CN | disclosed |
| CN-114174411-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-03-11 | — | — | CN | disclosed |
| US-11242425-B2 | Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2022-02-08 | — | — | US | disclosed |
| CN-113795377-A | Copper-clad laminate, resin-coated copper foil, and circuit board using same | 松下知识产权经营株式会社 | 2021-12-14 | — | — | CN | disclosed |
| CN-113574102-A | Prepreg, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2021-10-29 | — | — | CN | disclosed |
| US-20210246251-A1 | RESIN COMPOSITION, PREPREG, RESIN-ADDED FILM, RESIN-ADDED METAL FOIL, METAL-CLAD LAYERED PLATE, AND WIRING PLATE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2021-08-12 | — | — | US | disclosed |
| CN-112368311-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2021-02-12 | — | — | CN | disclosed |
| CN-112020523-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2020-12-01 | — | — | CN | disclosed |
| CN-111620982-A | Thermosetting resin composition, and adhesive sheet, metal-clad laminate and printed wiring board produced using same | 南亚新材料科技股份有限公司 | 2020-09-04 | — | — | CN | disclosed |
| CN-1914239-B | Curable resin composition | NIPPON STEEL CHEMICAL CO | 2010-05-05 | — | — | CN | disclosed |
| CN-1914239-A | Curable resin composition | NIPPON STEEL CHEMICAL CO (JP) | 2007-02-14 | — | — | CN | disclosed |