SCHEMBL2374140

SCHEMBL2374140

CCOC(CO)OCOC

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.33
LMNA P02545 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL605278 0.84
SCHEMBL27608092 0.82 THRB (0.42) THRBLMNA
SCHEMBL27698012 0.82 THRB (0.42) THRBLMNA
Alcohol SCHEMBL7259757 0.82 THRB (0.42) THRBLMNA
SCHEMBL7612393 0.80
SCHEMBL3522319 0.79 THRB (0.32) THRBLMNA
SCHEMBL69038 0.77
SCHEMBL16904109 0.75 ALDH1A1 (0.38) THRB
SCHEMBL27707581 0.75
SCHEMBL7773193 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118176241-A Polyamic acid varnish, polyimide composition, and adhesive 三井化学株式会社 2024-06-11 CN disclosed
US-12003235-B2 Tactile sensor formed on polyimide thin film having high total light transmittance, and switching device using same MITSUI CHEMICALS, INC. (JP) 2024-06-04 US disclosed
CN-117120511-A Polyamic acid composition, polyimide composition, adhesive, and laminate 三井化学株式会社 2023-11-24 CN disclosed
CN-117043231-A Polyamic acid composition, polyimide composition, adhesive, and laminate 三井化学株式会社 2023-11-10 CN disclosed
CN-112334521-B Polyamic acid, varnish, film, touch panel display, liquid crystal display, and organic EL display containing the same 三井化学株式会社 2023-05-09 CN disclosed
WO-2023013401-A1 POLYAMIC ACID COMPOSITION AND POLYIMIDE COMPOSITION, POLYIMIDE FILM, AND DISPLAY PANEL SUBSTRATE 三井化学株式会社 2023-02-09 WO disclosed
CN-110431696-B Binder composition for secondary battery 日本电气株式会社 2022-12-06 CN disclosed
US-20220239296-A1 TACTILE SENSOR FORMED ON POLYIMIDE THIN FILM HAVING HIGH TOTAL LIGHT TRANSMITTANCE, AND SWITCHING DEVICE USING SAME MITSUI CHEMICALS, INC. (JP) 2022-07-28 US disclosed
CN-114466745-A Polyimide film, polyamic acid, varnish containing same, polyimide laminate, and method for producing same 三井化学株式会社 2022-05-10 CN disclosed
EP-3988914-A1 TACTILE SENSOR FORMED ON POLYIMIDE THIN FILM HAVING HIGH TOTAL LIGHT TRANSMITTANCE, AND SWITCHING DEVICE USING SAME Mitsui Chemicals, Inc. (JP) 2022-04-27 EP disclosed
EP-0705862-B1 Poly(amic acid) solution UNITIKA LTD (JP) 2000-02-09 EP disclosed
EP-0573974-B1 Polyimide paper, polyimide composite paper and process for producing these products UNITIKA LTD (JP) 1998-09-02 EP disclosed
US-5719253-A APROTIC SOLVENT-FREE UNITIKA LTD. (JP) 1998-02-17 US disclosed
EP-0532954-B1 Process for producing a granular material of polyimide precursor. UNITIKA LTD (JP) 1997-04-02 EP disclosed
EP-0705862-A1 Poly(amic acid) solution, use thereof and polyimide film or polyimide-coated material obtained therefrom UNITIKA LTD. (JP) 1996-04-10 EP disclosed
US-5466732-A Polyimide precursor solution, process for producing the solution and moldings and coatings obtained therefrom UNITIKA LTD. (JP) 1995-11-14 US disclosed
US-5463016-A Tetracarboxylic dianhydride undergoes polymerization with a diamine in a solvent that does not exhibit a strong mutual interaction with the polyimide precursor UNITIKA LTD. (JP) 1995-10-31 US disclosed
EP-0573974-A1 Polyimide precursor fibrid, polyimide paper, polyimide composite paper and polyimide composite board obtained therefrom, and process for producing the fibrid and the paper products UNITIKA LTD. (JP) 1993-12-15 EP disclosed
EP-0532953-A2 Polyimide precursor solution, process for producing the solution, and moldings and coatings obtained therefrom UNITIKA LTD. (JP) 1993-03-24 EP disclosed
EP-0532954-A1 Granular material of polyimide precursor, mixture comprising the material and process for producing the material UNITIKA LTD. (JP) 1993-03-24 EP disclosed