SCHEMBL2380752

SCHEMBL2380752

O=C(Nc1cc(O)ccc1O)c1ccccc1

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 8/20 0.71
KCNMA1 Q12791 3/20 0.71
HDAC2 Q92769 2/20 0.71
GAA P10253 1/20 0.65
TP53 P04637 2/20 0.55
TOP1 P11387 2/20 0.54
TERT O14746 1/20 0.54
MEN1 O00255 1/20 0.54
MAPT P10636 1/20 0.54
PKM P14618 1/20 0.54
GRIK1 P39086 1/20 0.54
KMT2A Q03164 1/20 0.54
TDP1 Q9NUW8 1/20 0.54
TOP2A P11388 1/20 0.51
TOP2B Q02880 1/20 0.51
MDM4 O15151 1/20 0.51
HDAC3 O15379 1/20 0.51
MAPK1 P28482 1/20 0.51
POLB P06746 1/20 0.51
HPGD P15428 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10011045 0.86 KCNMA1 (0.57) HDAC1KCNMA1HDAC2GAATP53
SCHEMBL5178629 0.85 HDAC1 (0.69) HDAC1KCNMA1HDAC2GAATP53
SCHEMBL7817331 0.84 HDAC1 (0.69) HDAC1KCNMA1HDAC2GAAMEN1
SCHEMBL12510751 0.83 HDAC1 (0.67) HDAC1KCNMA1HDAC2GAATP53
SCHEMBL637477 0.83 KMT2A (0.70) MEN1MAPTPKMGRIK1KMT2A
SCHEMBL20612888 0.83 HDAC1 (0.68) HDAC1KCNMA1TP53MEN1MAPT
SCHEMBL12773868 0.83 KCNMA1 (0.72) HDAC1KCNMA1HDAC2GAAMEN1
SCHEMBL14476825 0.83 KCNMA1 (1.00) HDAC1KCNMA1HDAC2GAATP53
SCHEMBL10873010 0.83 KCNMA1 (1.00) HDAC1KCNMA1HDAC2GAATP53
SCHEMBL13213669 0.83 KCNMA1 (0.68) HDAC1KCNMA1HDAC2GAATP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8012676-B2 Process for preparing conductive material MITSUBISHI PAPER MILLS LIMITED (JP) 2011-09-06 US disclosed
US-7615324-B2 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM CORPORATION (JP) 2009-11-10 US disclosed
US-7615324-B2 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM CORPORATION (JP) 2009-11-10 US disclosed
US-20090233237-A1 Process For Preparing Conductive Material MITSUBISHI PAPER MILLS LIMITED (JP) 2009-09-17 US disclosed
US-7455948-B2 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2008-11-25 US disclosed
US-7455948-B2 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2008-11-25 US disclosed
US-20080227024-A1 PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2008-09-18 US disclosed
US-20080227024-A1 PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2008-09-18 US disclosed
EP-1970761-A1 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM Corporation (JP) 2008-09-17 EP disclosed
EP-0598241-B1 Lithographic printing material FUJI PHOTO FILM CO LTD (JP) 1998-02-04 EP disclosed
US-5387483-A Developer containing silver halide solvent and hydroquinone; has pH up to 11.8 FUJI PHOTO FILM CO., LTD. (JP) 1995-02-07 US disclosed
EP-0610936-A2 Lithographic printing material FUJI PHOTO FILM CO., LTD. (JP) 1994-08-17 EP disclosed
EP-0608777-A1 Processing of lithographic printing material FUJI PHOTO FILM CO., LTD. (JP) 1994-08-03 EP disclosed
EP-0601600-A2 Processing of lithographic printing material and developer used therein FUJI PHOTO FILM CO., LTD. (JP) 1994-06-15 EP disclosed
EP-0598241-A1 Lithographic printing material FUJI PHOTO FILM CO., LTD. (JP) 1994-05-25 EP disclosed
US-4283478-A COMPRISING A SILVER HALIDE LAYER AND A LAYER OF POSITIVE WORKING LIGHT SENSITIVE RESIN FUJI PHOTO FILM CO., LTD. (JP) 1981-08-11 US disclosed