Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SHBG | P04278 | 1/20 | 0.58 |
| ▸ | HMGB1 | P09429 | 1/20 | 0.50 |
| ▸ | CXCL12 | P48061 | 1/20 | 0.50 |
| ▸ | DHFR | P00374 | 2/20 | 0.47 |
| ▸ | PTPN1 | P18031 | 2/20 | 0.41 |
| ▸ | PTPN2 | P17706 | 1/20 | 0.41 |
| ▸ | PTPN6 | P29350 | 1/20 | 0.41 |
| ▸ | HSPA5 | P11021 | 1/20 | 0.41 |
| ▸ | PTGS1 | P23219 | 2/20 | 0.40 |
| ▸ | PTGS2 | P35354 | 2/20 | 0.40 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.40 |
| ▸ | ESR1 | P03372 | 2/20 | 0.39 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.39 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.39 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.39 |
| ▸ | CA1 | P00915 | 1/20 | 0.38 |
| ▸ | CA2 | P00918 | 1/20 | 0.38 |
| ▸ | ALK | Q9UM73 | 1/20 | 0.37 |
| ▸ | MAOA | P21397 | 1/20 | 0.36 |
| ▸ | MAOB | P27338 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30004950 | 1.00 | SHBG (0.58) | SHBGHMGB1CXCL12DHFRPTPN1 | |
| SCHEMBL4065757 | 1.00 | SHBG (0.58) | SHBGHMGB1CXCL12DHFRPTPN1 | |
| SCHEMBL30003742 | 0.96 | SHBG (0.63) | SHBGHMGB1CXCL12DHFRPTPN1 | |
| SCHEMBL2384360 | 0.96 | SHBG (0.63) | SHBGHMGB1CXCL12DHFRPTPN1 | |
| SCHEMBL4057392 | 0.92 | SHBG (0.67) | SHBGHMGB1CXCL12DHFRPTPN1 | |
| SCHEMBL7714483 | 0.92 | SHBG (0.67) | SHBGHMGB1CXCL12DHFRPTPN1 | |
| SCHEMBL15830868 | 0.91 | SHBG (0.53) | SHBGHMGB1CXCL12DHFRHSPA5 | |
| SCHEMBL7899901 | 0.91 | SHBG (0.47) | SHBGHMGB1CXCL12DHFRHSPA5 | |
| SCHEMBL3194655 | 0.90 | SHBG (0.55) | SHBGHMGB1CXCL12DHFRHSPA5 | |
| SCHEMBL69627 | 0.90 | SHBG (0.70) | SHBGHMGB1CXCL12DHFRPTPN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 99 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2203783-A2 | THICK FILM RESISTS | AZ Electronic Materials USA Corp. (US) | 2010-07-07 | — | — | EP | claimed |
| WO-2009040661-A2 | THICK FILM RESISTS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2009-04-02 | — | — | WO | claimed |
| US-20090081589-A1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2009-03-26 | — | — | US | claimed |
| EP-1623274-A2 | PHOTORESIST COMPOSITIONS | AZ Electronic Materials USA Corp. (US) | 2006-02-08 | — | — | EP | claimed |
| EP-1614005-A2 | PHOTORESIST COMPOSITIONS | AZ Electronic Materials USA Corp. (US) | 2006-01-11 | — | — | EP | claimed |
| WO-2004088424-A2 | PHOTORESIST COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2004-10-14 | — | — | WO | claimed |
| WO-2004088423-A2 | PHOTORESIST COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2004-10-14 | — | — | WO | claimed |
| US-20040197696-A1 | Photoresist compositions | AZ ELECTRONIC MATERIALS USA CORP. | 2004-10-07 | — | — | US | claimed |
| US-20040197704-A1 | Photoresist compositions | AZ ELECTRONIC MATERIALS USA CORP. | 2004-10-07 | — | — | US | claimed |
| US-6790582-B1 | NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT | CLARIANT FINANCE BVI LIMITED (VG) | 2004-09-14 | — | — | US | claimed |
| EP-3961676-B1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2025-01-22 | — | — | EP | disclosed |
| EP-3896522-B1 | PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-03 | — | — | EP | disclosed |
| US-11487200-B2 | Positive-type photosensitive resin composition and cured film prepared therefrom | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. | 2022-11-01 | — | — | US | disclosed |
| EP-3961676-A1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-03-02 | — | — | EP | disclosed |
| US-20220026801-A1 | CHEMICALLY AMPLIFIED POSITIVE -TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD (JP) | 2022-01-27 | — | — | US | disclosed |
| US-6296992-B1 | CONTACT APERTURES BY PHASE SHIFT METHOD WITH PHOTORESIST FILM | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-10-02 | — | — | US | disclosed |
| US-6207788-B1 | FROM 2,6-DIMETHYLOL-4-METHYLPHENOL AND BIS(2,5-DIMETHYL-4-HYDROXYPHENYL)METHANE | TOKYO OHKA KOGYA CO., LTD. (JP) | 2001-03-27 | — | — | US | disclosed |
| US-6187500-B1 | PHOTORESIST MATERIAL COMPRISING BLEND OF ALKALI-SOLUBLE NOVOLAK RESIN AND A 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONIC ESTER; FINE RESOLUTION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-02-13 | — | — | US | disclosed |
| US-6177226-B1 | PROVIDES A CONTACT HOLE PATTERN IMAGE HAVING LESS DIMPLES AND BEING IN EXACT ACCORDANCE WITH A MASK PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-01-23 | — | — | US | disclosed |
| EP-0902326-A2 | Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-03-17 | — | — | EP | disclosed |