SCHEMBL2389991

SCHEMBL2389991

C[SiH](C)OCCCN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1365947 0.92
SCHEMBL1760487 0.89 DNM1 (0.42)
SCHEMBL56550 0.81
SCHEMBL12311052 0.81
Methylamine SCHEMBL16469691 0.74 ADRB2 (0.46)
SCHEMBL31395027 0.73
SCHEMBL15170746 0.72 CA12 (0.50)
SCHEMBL4815552 0.72 ODC1 (0.39)
SCHEMBL19996165 0.72 ODC1 (0.39)
SCHEMBL14299752 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11920038-B2 Method for manufacturing processed cork chip and method for constructing floor using same A-ROAD CO. (KR) 2024-03-05 US disclosed
CN-114173836-A Surface coating structure for surgical prosthesis and method for modifying surface of surgical prosthesis using the same 株式会社OID 2022-03-11 CN disclosed
US-20210163747-A1 METHOD FOR MANUFACTURING PROCESSED CORK CHIP AND METHOD FOR CONSTRUCTING FLOOR USING SAME A-ROAD CO. (KR) 2021-06-03 US disclosed
CN-112759607-A Method for producing imino group-containing organooxysilane compound 信越化学工业株式会社 2021-05-07 CN disclosed
EP-3042907-A1 DGAT1 INHIBITOR AND PREPARATION METHOD AND USE THEREOF Medshine Discovery Inc. (CN) 2016-07-13 EP disclosed
US-9365756-B1 Low-melt poly(amic acids) and polyimides and their uses THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) 2016-06-14 US disclosed
US-8791185-B2 2-ethylhexyl methyl terephthalate as plasticizer in adhesives and sealants BASF SE (DE) 2014-07-29 US disclosed
US-20140045969-A1 Curable Composition CONSTRUCTION RESEARCH & TECHNOLOGY GMBH (DE) 2014-02-13 US disclosed
US-20110232825-A1 CYCLOHEXANE POLYCARBOXYLIC ACID DERIVATIVES AS PLASTICIZERS FOR ADHESIVES AND SEALANTS BASF SE (DE) 2011-09-29 US disclosed
US-7387832-B2 Flat particles and process for production thereof NISSHINBO INDUSTRIES, INC. (JP) 2008-06-17 US disclosed
US-20050271875-A1 Composite particle with a carbodimide resin layer and process for producing the same NISSHINBO INDUSTRIES, INC. (JP) 2005-12-08 US disclosed
EP-1553124-A1 FLAKY PARTICLES AND PROCESS FOR PRODUCTION THEREOF Nisshinbo Industries, Inc. (JP) 2005-07-13 EP disclosed
US-20050118424-A1 particles comprising thermoplastic resins impregnated with carbodiimide compounds, having heat and solvent resistance, used as curing agents, stabilizers, hardeners, adhesives, coatings, paints, reinforcements and in automobiles, electronics, furniture, construction materials and as spacers TAKAHASHI IKUO (JP) 2005-06-02 US disclosed
EP-1528077-A1 COMPOSITE PARTICLE HAVING CARBODIIMIDE RESIN LAYER AND PROCESS FOR PRODUCING THE SAME Nisshinbo Industries, Inc. (JP) 2005-05-04 EP disclosed
US-6866934-B2 A thermoplastic resin having a functional group and carbodiimide compound impregnated only in the surface layer section or both surface layer section and inside the base particle and both are strongly bonded by crosslinking reaction NISSHINBO INDUSTRIES, INC. (JP) 2005-03-15 US disclosed
US-20030215636-A1 A thermoplastic resin having a functional group and carbodiimide compound impregnated only in the surface layer section or both surface layer section and inside the base particle and both are strongly bonded by crosslinking reaction NISSHINBO INDUSTRIES, INC. (JP) 2003-11-20 US disclosed
EP-1344795-A2 Carbodiimide-containing hardening type reactive particles, process for producing the same, and use of the same NISSHINBO INDUSTRIES, INC. (JP) 2003-09-17 EP disclosed
EP-0648796-B1 Solutions of polyimide-forming substances and their use SCHENECTADY INT INC (US) 1998-08-26 EP disclosed
US-5493003-A MIXTURES OF AMINES, AMIDES AND/OR ESTERS OF TETRACARBOXYLIC ACIDS HAVING AMIDO OR ESTER GROUPS SUBSTITUTED WITH CARBOXYL, SULFO, SILYL OR SILOXY GROUPS, ELECTRONICS BASF LACKE + FARBEN AKTIENGESELLSCHAFT (DE) 1996-02-20 US disclosed
EP-0648796-A1 Solutions of polyimide-forming substances and their use BASF Lacke + Farben AG (DE) 1995-04-19 EP disclosed