SCHEMBL23909539

SCHEMBL23909539

NS(=O)(=O)c1ccc2cccc([N+](=O)[O-])c2c1

nearest known ligand 0.58

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
CA2 P00918 8/20 0.58
CA1 P00915 7/20 0.58
CA12 O43570 6/20 0.58
CA9 Q16790 6/20 0.58
VCAM1 P19320 1/20 0.57
ALDH1A1 P00352 2/20 0.56
CA5A P35218 1/20 0.54
LMNA P02545 1/20 0.51
TDP1 Q9NUW8 2/20 0.51
MAPT P10636 2/20 0.51
POLB P06746 1/20 0.51
NQO2 P16083 1/20 0.49
MTNR1A P48039 1/20 0.49
MTNR1B P49286 1/20 0.49
DOT1L Q8TEK3 1/20 0.48
PTPN11 Q06124 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14058836 0.87 CA2 (0.58) CA2CA1CA12CA9VCAM1
SCHEMBL28467532 0.84 ALDH1A1 (0.56) CA2CA1CA12CA9VCAM1
SCHEMBL9838979 0.84 ALDH1A1 (0.56) CA2CA1CA12CA9ALDH1A1
SCHEMBL23909572 0.84 ALDH1A1 (0.56) CA2CA1CA12CA9VCAM1
SCHEMBL28467530 0.83 ALDH1A1 (0.54) CA2CA1CA12CA9ALDH1A1
SCHEMBL4277463 0.78 ALDH1A1 (0.61) ALDH1A1TDP1MAPTPOLB
SCHEMBL27915770 0.77 CA2 (0.72) CA2CA1CA12CA9VCAM1
SCHEMBL9735773 0.77 ALDH1A1 (0.69) ALDH1A1TDP1MAPTPOLB
SCHEMBL20608200 0.76 ALDH1A1 (0.63) ALDH1A1TDP1MAPTPOLB
SCHEMBL187061 0.76 ALDH1A1 (0.63) ALDH1A1LMNATDP1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed