SCHEMBL23909546

SCHEMBL23909546

N#Cc1cccc2c(S(N)(=O)=O)cccc12

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CDK2 P24941 1/20 0.56
CA2 P00918 8/20 0.53
CA9 Q16790 5/20 0.53
CA1 P00915 4/20 0.53
CA12 O43570 4/20 0.47
LDHA P00338 1/20 0.47
PNMT P11086 2/20 0.44
ALDH1A1 P00352 1/20 0.43
HTT P42858 1/20 0.43
ATIC P31939 1/20 0.40
CA4 P22748 2/20 0.39
CA6 P23280 2/20 0.39
CYP2C9 P11712 1/20 0.39
CA5A P35218 1/20 0.39
CA7 P43166 1/20 0.39
CA14 Q9ULX7 1/20 0.39
CA5B Q9Y2D0 1/20 0.39
TTR P02766 1/20 0.38
PTGES2 Q9H7Z7 1/20 0.38
ALOX5 P09917 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29961798 0.84 CA2 (0.58) CA2CA9CA1CA12ALDH1A1
SCHEMBL291455 0.84 CA2 (0.58) CA2CA9CA1CA12ALDH1A1
SCHEMBL9138970 0.82 CDK2 (0.78) CDK2CA2CA9CA1CA12
SCHEMBL5242541 0.81 HTT (0.43) CDK2CA2CA1PNMTALDH1A1
SCHEMBL5243474 0.81 TTR (0.55) CDK2CA2CA1PNMTALDH1A1
SCHEMBL23909578 0.78 CA2 (0.48) CDK2CA2CA9CA1CA12
SCHEMBL25167721 0.78 CA2 (0.46) CDK2CA2CA9CA1CA12
SCHEMBL45954 0.77 CA1 (0.54) CA2CA1PNMTALDH1A1HTT
SCHEMBL29489124 0.77 CA1 (0.54) CA2CA1PNMTALDH1A1HTT
SCHEMBL7768529 0.74 CA2 (0.44) CA2CA9CA1CA12ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed