SCHEMBL23909578

SCHEMBL23909578

N#Cc1cccc2cccc(S(N)(=O)=O)c12

nearest known ligand 0.48

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CA2 P00918 8/20 0.48
CA9 Q16790 6/20 0.48
CA1 P00915 5/20 0.48
CA12 O43570 4/20 0.43
ALDH1A1 P00352 1/20 0.43
HTT P42858 1/20 0.43
MAPK1 P28482 1/20 0.43
SLC40A1 Q9NP59 1/20 0.41
CA4 P22748 2/20 0.39
CA6 P23280 2/20 0.39
CYP2C9 P11712 1/20 0.39
CA5A P35218 1/20 0.39
CA7 P43166 1/20 0.39
CA14 Q9ULX7 1/20 0.39
CA5B Q9Y2D0 1/20 0.39
CDK2 P24941 1/20 0.39
SLC22A12 Q96S37 2/20 0.38
MAP2K1 Q02750 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7813445 0.84 TTR (0.47) CA2CA1ALDH1A1HTTSLC40A1
SCHEMBL23909570 0.84 HTT (0.42) CA2CA1ALDH1A1HTTMAPK1
SCHEMBL29961798 0.80 CA2 (0.58) CA2CA9CA1CA12ALDH1A1
SCHEMBL291455 0.80 CA2 (0.58) CA2CA9CA1CA12ALDH1A1
SCHEMBL23909546 0.78 CDK2 (0.56) CA2CA9CA1CA12ALDH1A1
SCHEMBL25167721 0.78 CA2 (0.46) CA2CA9CA1CA12ALDH1A1
SCHEMBL29973162 0.77 CA1 (0.50) CA2CA1ALDH1A1HTTMAPK1
SCHEMBL819594 0.77 CA1 (0.50) CA2CA1ALDH1A1HTTMAPK1
Hydrogen Sulfide SCHEMBL29288364 0.75 CA1 (0.48) CA2CA1ALDH1A1HTTMAPK1
SCHEMBL10338061 0.75 TSHR (0.50) CA2CA1ALDH1A1HTTMAP2K1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed