SCHEMBL23909557

SCHEMBL23909557

NC(=O)c1cccc2cc([N+](=O)[O-])ccc12

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 6/20 0.54
▸ KDM4E B2RXH2 1/20 0.54
▸ GAA P10253 1/20 0.54
▸ KMT2A Q03164 6/20 0.54
▸ TSHR P16473 4/20 0.53
▸ POLB P06746 3/20 0.52
▸ MEN1 O00255 5/20 0.50
▸ HPGD P15428 1/20 0.50
▸ DUSP3 P51452 1/20 0.50
▸ PTPN5 P54829 1/20 0.50
▸ PTPN11 Q06124 1/20 0.50
▸ NPC1 O15118 3/20 0.47
▸ RAB9A P51151 3/20 0.47
▸ MAPT P10636 2/20 0.47
▸ KCNH2 Q12809 1/20 0.47
▸ PARP1 P09874 1/20 0.47
▸ ATM Q13315 1/20 0.46
▸ SMN1; SMN2 Q16637 3/20 0.46
▸ CYP3A4 P08684 2/20 0.46
▸ CYP1A2 P05177 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909587 0.88 ALDH1A1 (0.54) ALDH1A1KDM4EGAAKMT2ATSHR
SCHEMBL3556091 0.86 PTPN1 (0.58) ALDH1A1KMT2ATSHRMEN1MAPT
SCHEMBL7673918 0.84 ALDH1A1 (0.53) ALDH1A1KMT2ATSHRPOLBMEN1
SCHEMBL3757019 0.83 MEN1 (0.52) ALDH1A1KMT2ATSHRPOLBMEN1
SCHEMBL17288756 0.83 TSHR (0.46) ALDH1A1KMT2ATSHRPOLBMEN1
SCHEMBL6986224 0.77 SMN1; SMN2 (0.55) ALDH1A1KMT2ATSHRPOLBMEN1
SCHEMBL26885154 0.77 LMNA (0.56) KMT2APOLBMEN1MAPTSMN1; SMN2
SCHEMBL774702 0.77 TSHR (0.52) ALDH1A1KDM4EGAATSHRHPGD
SCHEMBL8686354 0.77 TDP1 (0.52) ALDH1A1GAAKMT2ATSHRMEN1
SCHEMBL31447779 0.77 TDP1 (0.52) ALDH1A1GAAKMT2ATSHRMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112672816-A Aromatic amide dispersants 路博润先进材料公司 2021-04-16 — — CN claimed
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 — — CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 — — EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 — — US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 — — CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 — — EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 — — US disclosed
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