SCHEMBL23909559

SCHEMBL23909559

O=C(Cl)c1ccc2ccc([N+](=O)[O-])cc2c1

nearest known ligand 0.65

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.65
TSHR P16473 2/20 0.62
CES1 P23141 3/20 0.48
CA1 P00915 2/20 0.47
CA2 P00918 2/20 0.47
TDP1 Q9NUW8 1/20 0.47
KMT2A Q03164 2/20 0.47
MEN1 O00255 1/20 0.47
MAPK1 P28482 1/20 0.46
MAOA P21397 1/20 0.43
MAOB P27338 1/20 0.43
CES2 O00748 2/20 0.43
SRD5A2 P31213 1/20 0.43
HSD17B10 Q99714 1/20 0.43
IKBKB O14920 1/20 0.43
POLB P06746 1/20 0.42
GSK3B P49841 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11775169 0.95 ALDH1A1 (0.67) ALDH1A1TSHRCES1CA1CA2
SCHEMBL27553610 0.84 TDP1 (0.63) ALDH1A1TSHRCES1TDP1KMT2A
SCHEMBL23909526 0.83 TSHR (0.65) ALDH1A1TSHRCES1CA1CA2
SCHEMBL1681902 0.81 CES2 (0.50) ALDH1A1TSHRCES1TDP1KMT2A
SCHEMBL3829978 0.81 TSHR (0.56) ALDH1A1TSHRTDP1MAPK1MAOB
4-Nitrobenzoyl Chloride SCHEMBL28873526 0.79 ALDH1A1 (1.00) ALDH1A1TSHRCES1CA1CA2
4-Nitrobenzoyl Chloride SCHEMBL43141 0.79 ALDH1A1 (1.00) ALDH1A1TSHRCES1CA1CA2
SCHEMBL27553609 0.79 TDP1 (0.66) ALDH1A1TSHRCES1CA1CA2
4-Nitrobenzoyl Chloride SCHEMBL5400755 0.77 ALDH1A1 (0.96) ALDH1A1TSHRCES1CA1CA2
Hydrochloric Acid SCHEMBL11775184 0.77 TDP1 (0.63) ALDH1A1TSHRCES1TDP1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed