SCHEMBL23909560

SCHEMBL23909560

COC(=O)c1ccc2ccc(S(=O)(=O)Cl)cc2c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PLAU P00749 3/20 0.50
POLB P06746 3/20 0.50
LCK P06239 1/20 0.48
PTPN11 Q06124 1/20 0.47
CA12 O43570 4/20 0.46
CA1 P00915 4/20 0.46
CA2 P00918 4/20 0.46
CA9 Q16790 4/20 0.46
CA14 Q9ULX7 3/20 0.46
CYP2C9 P11712 3/20 0.45
CA7 P43166 1/20 0.45
XDH P47989 1/20 0.45
TP53 P04637 1/20 0.44
THRB P10828 1/20 0.44
FBP1 P09467 1/20 0.44
PTGS2 P35354 1/20 0.44
VCAM1 P19320 1/20 0.43
KDM4E B2RXH2 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
HSD17B10 Q99714 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22662913 0.95 PTPN11 (0.51) PLAUPOLBLCKPTPN11CA12
SCHEMBL709231 0.83 LCK (0.62) LCKPTPN11CA12CA1CA2
SCHEMBL118882 0.81 CA1 (0.61) POLBCA12CA1CA2CA9
SCHEMBL29457845 0.79 POLB (0.55) POLBCA12CA1CA2CA9
SCHEMBL119413 0.79 POLB (0.55) POLBCA12CA1CA2CA9
SCHEMBL23909550 0.78 LCK (0.54) PLAULCKPTPN11CA12CA1
SCHEMBL9979782 0.77 PTPN11 (0.64) PLAULCKPTPN11CA12CA1
SCHEMBL69025 0.77 PTPN11 (0.68) PLAULCKPTPN11CA12CA1
SCHEMBL29365729 0.77 PTPN11 (0.68) PLAULCKPTPN11CA12CA1
SCHEMBL30615201 0.77 LMNA (0.46) CA1CA2CA9CYP2C9SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed