SCHEMBL23909569

SCHEMBL23909569

O=C(Cl)c1cccc2ccc([N+](=O)[O-])cc12

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 5/20 0.53
▸ TSHR P16473 3/20 0.53
▸ RORC P51449 1/20 0.49
▸ KMT2A Q03164 6/20 0.46
▸ MEN1 O00255 5/20 0.46
▸ NPC1 O15118 2/20 0.46
▸ MAPT P10636 2/20 0.46
▸ RAB9A P51151 2/20 0.46
▸ POLB P06746 2/20 0.46
▸ LMNA P02545 2/20 0.46
▸ TNF P01375 1/20 0.46
▸ NOD1 Q9Y239 1/20 0.46
▸ SMN1; SMN2 Q16637 1/20 0.44
▸ HPGD P15428 1/20 0.44
▸ DUSP3 P51452 1/20 0.44
▸ PTPN5 P54829 1/20 0.44
▸ PTPN11 Q06124 1/20 0.44
▸ ALOX5 P09917 1/20 0.44
▸ PTPN1 P18031 1/20 0.44
▸ CES2 O00748 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7673918 0.88 ALDH1A1 (0.53) ALDH1A1TSHRRORCKMT2AMEN1
SCHEMBL27553611 0.86 PTPN1 (0.53) ALDH1A1RORCKMT2AMEN1NPC1
SCHEMBL23909587 0.84 ALDH1A1 (0.54) ALDH1A1TSHRRORCKMT2AMEN1
SCHEMBL4962039 0.83 MEN1 (0.52) ALDH1A1TSHRRORCKMT2AMEN1
SCHEMBL26885156 0.77 LMNA (0.53) RORCKMT2AMEN1NPC1MAPT
SCHEMBL4958995 0.77 TSHR (0.52) ALDH1A1TSHRKMT2AMEN1NPC1
SCHEMBL27573659 0.77 HSD17B10 (0.53) ALDH1A1TSHRRORCKMT2AMEN1
SCHEMBL29903883 0.76 MEN1 (0.65) ALDH1A1TSHRKMT2AMEN1MAPT
SCHEMBL8623371 0.76 MEN1 (0.65) ALDH1A1TSHRKMT2AMEN1MAPT
SCHEMBL29450699 0.76 MEN1 (0.65) ALDH1A1TSHRKMT2AMEN1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 — — EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 — — US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 — — CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 — — EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 — — US disclosed
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