Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 4/20 | 0.50 |
| ▸ | CA2 | P00918 | 4/20 | 0.50 |
| ▸ | TRPV4 | Q9HBA0 | 2/20 | 0.49 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 1/20 | 0.37 |
| ▸ | HPGD | P15428 | 1/20 | 0.37 |
| ▸ | HTT | P42858 | 1/20 | 0.37 |
| ▸ | CNR1 | P21554 | 1/20 | 0.37 |
| ▸ | CNR2 | P34972 | 1/20 | 0.37 |
| ▸ | RAD51 | Q06609 | 1/20 | 0.36 |
| ▸ | CA9 | Q16790 | 1/20 | 0.36 |
| ▸ | SLC22A12 | Q96S37 | 3/20 | 0.36 |
| ▸ | KAT6A | Q92794 | 1/20 | 0.36 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.35 |
| ▸ | CYP19A1 | P11511 | 2/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23909530 | 0.87 | CA1 (0.54) | CA1CA2TRPV4CNR1CNR2 | |
| SCHEMBL23909576 | 0.84 | CA1 (0.56) | CA1CA2KDM4EALDH1A1LMNA | |
| SCHEMBL12212866 | 0.84 | CA1 (0.50) | CA1CA2TRPV4KDM4EALDH1A1 | |
| SCHEMBL10408524 | 0.77 | CA1 (0.42) | CA1CA2TRPV4KDM4EALDH1A1 | |
| SCHEMBL27040545 | 0.76 | TRPV4 (0.43) | CA1CA2TRPV4KDM4EMAPT | |
| SCHEMBL11136985 | 0.76 | HTR6 (0.41) | CA1CA2ALDH1A1LMNACA9 | |
| SCHEMBL10408514 | 0.75 | CA1 (0.41) | CA1CA2KDM4EALDH1A1MAPT | |
| SCHEMBL19441037 | 0.75 | CYP2A6 (0.53) | CA1CA2MAPTCA9 | |
| SCHEMBL8493412 | 0.75 | CTDSP1 (0.50) | CA1CA2ALDH1A1LMNACA9 | |
| SCHEMBL4109390 | 0.74 | CA1 (0.53) | CA1CA2KDM4EALDH1A1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113527680-B | Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component | 信越化学工业株式会社 | 2023-04-28 | — | — | CN | disclosed |
| EP-3896521-B1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2022-12-14 | — | — | EP | disclosed |
| US-11333975-B2 | Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2022-05-17 | — | — | US | disclosed |
| CN-113527680-A | Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component | 信越化学工业株式会社 | 2021-10-22 | — | — | CN | disclosed |
| EP-3896521-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-10-20 | — | — | EP | disclosed |
| US-20210317268-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |