SCHEMBL23909581

SCHEMBL23909581

Cc1c(C(=O)O)ccc2c(C(N)=O)cccc12

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 2/20 0.47
ATM Q13315 1/20 0.47
TSHR P16473 1/20 0.44
NR4A1 P22736 1/20 0.43
NR4A2 P43354 1/20 0.43
NR4A3 Q92570 1/20 0.43
TBXAS1 P24557 1/20 0.43
KDM4E B2RXH2 3/20 0.42
ALDH1A1 P00352 3/20 0.42
MYC P01106 2/20 0.42
GAA P10253 1/20 0.42
HSD17B10 Q99714 2/20 0.42
HPGD P15428 1/20 0.42
NPC1 O15118 1/20 0.41
CASP3 P42574 1/20 0.41
RAB9A P51151 1/20 0.41
SENP8 Q96LD8 1/20 0.41
SENP7 Q9BQF6 1/20 0.41
SENP6 Q9GZR1 1/20 0.41
CDC25B P30305 2/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7916759 0.83 NR4A1 (0.59) KMT2AATMTSHRNR4A1NR4A2
SCHEMBL23909590 0.83 TSHR (0.44) KMT2ATSHRNR4A1NR4A2NR4A3
SCHEMBL634715 0.82 KMT2A (0.46) KMT2AATMTSHRKDM4EALDH1A1
SCHEMBL28088886 0.81 NR4A1 (0.65) KMT2ANR4A1NR4A2NR4A3KDM4E
SCHEMBL2431512 0.81 TSHR (0.52) KMT2ATSHRKDM4EALDH1A1MYC
SCHEMBL10015552 0.81 CYP1A2 (0.50) KMT2ATSHRKDM4EALDH1A1MYC
SCHEMBL18936303 0.80 KDM4E (0.50) KMT2ATSHRNR4A1NR4A2NR4A3
SCHEMBL30218700 0.80 KDM4E (0.50) KMT2ATSHRNR4A1NR4A2NR4A3
SCHEMBL5750127 0.79 ATM (0.64) KMT2AATMTSHRNR4A1NR4A2
SCHEMBL6135290 0.79 ATM (0.61) KMT2AATMTSHRNR4A1NR4A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed