SCHEMBL23909582

SCHEMBL23909582

COC(=O)c1ccc2c(C(N)=O)cccc2c1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LCK P06239 2/20 0.54
ALDH1A1 P00352 3/20 0.53
KDM4E B2RXH2 2/20 0.53
GAA P10253 2/20 0.53
PTPN1 P18031 1/20 0.51
SIRT2 Q8IXJ6 1/20 0.50
ALOX15 P16050 1/20 0.49
HTT P42858 1/20 0.49
GLA P06280 1/20 0.47
MAPT P10636 1/20 0.47
HPGD P15428 1/20 0.47
CASP1 P29466 1/20 0.47
CASP7 P55210 1/20 0.47
ATM Q13315 1/20 0.47
HSD17B10 Q99714 1/20 0.47
JAK2 O60674 1/20 0.46
AURKA O14965 4/20 0.46
MET P08581 4/20 0.46
KDR P35968 4/20 0.46
TEK Q02763 4/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30213808 0.89 LCK (0.58) LCKALDH1A1KDM4EGAAPTPN1
SCHEMBL69179 0.89 LCK (0.58) LCKALDH1A1KDM4EGAAPTPN1
SCHEMBL30362183 0.88 PLAU (0.54) LCKALDH1A1KDM4EGAAPTPN1
SCHEMBL23909555 0.88 PLAU (0.54) LCKALDH1A1KDM4EGAAPTPN1
SCHEMBL23909566 0.88 PTPN1 (0.51) LCKALDH1A1KDM4EGAAPTPN1
SCHEMBL23909591 0.85 LCK (0.54) LCKALDH1A1KDM4EGAAPTPN1
SCHEMBL17288606 0.85 LCK (0.54) LCKALDH1A1KDM4EGAAPTPN1
SCHEMBL29463701 0.84 ALDH1A1 (0.62) LCKALDH1A1KDM4EGAAPTPN1
SCHEMBL6384957 0.84 ALDH1A1 (0.62) LCKALDH1A1KDM4EGAAPTPN1
Methyl Benzoate SCHEMBL29069398 0.82 TSHR (0.58) ALDH1A1KDM4EGAASIRT2MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed