SCHEMBL23909555

SCHEMBL23909555

COC(=O)c1ccc2cccc(C(N)=O)c2c1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PLAU P00749 4/20 0.54
ALDH1A1 P00352 3/20 0.53
KDM4E B2RXH2 2/20 0.53
GAA P10253 2/20 0.53
SIRT2 Q8IXJ6 1/20 0.50
GLA P06280 1/20 0.47
MAPT P10636 1/20 0.47
HPGD P15428 1/20 0.47
CASP1 P29466 1/20 0.47
CASP7 P55210 1/20 0.47
ATM Q13315 1/20 0.47
HSD17B10 Q99714 1/20 0.47
NQO2 P16083 1/20 0.47
MTNR1A P48039 1/20 0.47
LCK P06239 1/20 0.47
PLAT P00750 1/20 0.46
PTPN11 Q06124 1/20 0.46
ALOX15 P16050 1/20 0.46
HTT P42858 1/20 0.46
LOXL2 Q9Y4K0 2/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30362183 1.00 PLAU (0.54) PLAUALDH1A1KDM4EGAASIRT2
SCHEMBL29576093 0.89 MAPT (0.51) PLAUALDH1A1KDM4EGAAGLA
SCHEMBL68296 0.89 MAPT (0.51) PLAUALDH1A1KDM4EGAAGLA
SCHEMBL23909582 0.88 LCK (0.54) PLAUALDH1A1KDM4EGAASIRT2
SCHEMBL23909601 0.88 PLAU (0.54) PLAUALDH1A1KDM4EGAASIRT2
SCHEMBL23909536 0.85 NQO2 (0.47) PLAUALDH1A1KDM4EGAAGLA
SCHEMBL30362194 0.85 NQO2 (0.47) PLAUALDH1A1KDM4EGAAGLA
SCHEMBL28124449 0.84 KDM4E (0.62) PLAUALDH1A1KDM4EGAALCK
Methyl Benzoate SCHEMBL29069398 0.82 TSHR (0.58) ALDH1A1KDM4EGAASIRT2MAPT
SCHEMBL29257026 0.81 PLAU (0.58) PLAUALDH1A1KDM4EGAAGLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed