SCHEMBL23909591

SCHEMBL23909591

COC(=O)c1ccc2c(C(=O)Cl)cccc2c1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LCK P06239 1/20 0.54
PTPN1 P18031 1/20 0.51
ALOX15 P16050 1/20 0.49
HTT P42858 1/20 0.49
PTPN11 Q06124 2/20 0.46
KIF11 P52732 1/20 0.46
KDM4E B2RXH2 2/20 0.44
ALDH1A1 P00352 2/20 0.44
HPGD P15428 2/20 0.44
GLA P06280 1/20 0.44
GAA P10253 1/20 0.44
MAPT P10636 1/20 0.44
CASP1 P29466 1/20 0.44
CASP7 P55210 1/20 0.44
ATM Q13315 1/20 0.44
HSD17B10 Q99714 1/20 0.44
CA12 O43570 1/20 0.44
CA1 P00915 1/20 0.44
CA2 P00918 1/20 0.44
CA7 P43166 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL69179 0.89 LCK (0.58) LCKPTPN1ALOX15HTTPTPN11
SCHEMBL30213808 0.89 LCK (0.58) LCKPTPN1ALOX15HTTPTPN11
SCHEMBL30362194 0.88 NQO2 (0.47) LCKALOX15HTTPTPN11KIF11
SCHEMBL23909536 0.88 NQO2 (0.47) LCKALOX15HTTPTPN11KIF11
SCHEMBL23909525 0.88 PTPN1 (0.51) LCKPTPN1ALOX15HTTPTPN11
SCHEMBL30362287 0.88 PTPN1 (0.51) LCKPTPN1ALOX15HTTPTPN11
SCHEMBL23909582 0.85 LCK (0.54) LCKPTPN1ALOX15HTTPTPN11
SCHEMBL17288606 0.85 LCK (0.54) LCKPTPN1ALOX15HTTPTPN11
SCHEMBL2154228 0.84 PTPN1 (0.61) PTPN1ALOX15KDM4EALDH1A1HPGD
SCHEMBL31625685 0.84 PTPN1 (0.61) PTPN1ALOX15KDM4EALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed