SCHEMBL23909585

SCHEMBL23909585

N#Cc1ccc2ccc(C(=O)Cl)cc2c1

nearest known ligand 0.44

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
PLAU P00749 3/20 0.44
F2 P00734 1/20 0.44
PLG P00747 1/20 0.44
KLKB1 P03952 1/20 0.44
PRSS1 P07477 1/20 0.44
MEN1 O00255 1/20 0.44
NPC1 O15118 1/20 0.44
RAB9A P51151 1/20 0.44
KMT2A Q03164 1/20 0.44
CA1 P00915 4/20 0.44
CA2 P00918 4/20 0.44
KDM2B Q8NHM5 5/20 0.41
GSK3B P49841 2/20 0.41
SIRT1 Q96EB6 1/20 0.40
CDY1; CDY1B Q9Y6F8 1/20 0.40
NCEH1 Q6PIU2 1/20 0.40
HSD17B14 Q9BPX1 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5566845 0.95 PLAU (0.49) PLAUF2PLGKLKB1PRSS1
SCHEMBL3560794 0.84 SLC22A12 (0.51) PLAUF2PLGKLKB1PRSS1
SCHEMBL1681902 0.82 CES2 (0.50) PLAUF2PLGKLKB1PRSS1
SCHEMBL6635557 0.82 LCK (0.55) PLAUF2PLGKLKB1PRSS1
SCHEMBL1950 0.78 CA2 (0.61) NPC1RAB9ACA1CA2GSK3B
SCHEMBL3558563 0.78 PLAU (0.59) PLAUF2PLGKLKB1PRSS1
SCHEMBL1341822 0.78 CYP2A6 (0.52) PLAUF2PLGKLKB1PRSS1
SCHEMBL29489123 0.78 CYP2A6 (0.52) PLAUF2PLGKLKB1PRSS1
SCHEMBL3561878 0.78 PLAU (0.54) PLAUF2PLGKLKB1PRSS1
Hydrochloric Acid SCHEMBL5264593 0.77 CA2 (0.59) NPC1RAB9ACA1CA2GSK3B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed