SCHEMBL23909536

SCHEMBL23909536

COC(=O)c1ccc2cccc(C(=O)Cl)c2c1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NQO2 P16083 1/20 0.47
PLAU P00749 4/20 0.47
MTNR1A P48039 1/20 0.47
LCK P06239 1/20 0.47
PTPN11 Q06124 2/20 0.46
ALOX15 P16050 1/20 0.46
HTT P42858 1/20 0.46
PLA2G2D Q9UNK4 1/20 0.44
KDM4E B2RXH2 2/20 0.44
ALDH1A1 P00352 2/20 0.44
GLA P06280 1/20 0.44
GAA P10253 1/20 0.44
MAPT P10636 1/20 0.44
HPGD P15428 1/20 0.44
CASP1 P29466 1/20 0.44
CASP7 P55210 1/20 0.44
ATM Q13315 1/20 0.44
HSD17B10 Q99714 1/20 0.44
CA12 O43570 1/20 0.44
CA1 P00915 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30362194 1.00 NQO2 (0.47) NQO2PLAUMTNR1ALCKPTPN11
SCHEMBL68296 0.89 MAPT (0.51) NQO2PLAUMTNR1ALCKPTPN11
SCHEMBL29576093 0.89 MAPT (0.51) NQO2PLAUMTNR1ALCKPTPN11
SCHEMBL23909574 0.88 PLAU (0.47) NQO2PLAUMTNR1ALCKPTPN11
SCHEMBL23909591 0.88 LCK (0.54) PLAULCKPTPN11ALOX15HTT
SCHEMBL23909555 0.85 PLAU (0.54) NQO2PLAUMTNR1ALCKPTPN11
SCHEMBL30362183 0.85 PLAU (0.54) NQO2PLAUMTNR1ALCKPTPN11
SCHEMBL2154707 0.84 PLA2G2D (0.51) PLAUMTNR1AALOX15PLA2G2DKDM4E
SCHEMBL26887048 0.81 PLAU (0.50) NQO2PLAUMTNR1ALCKPTPN11
SCHEMBL28311980 0.80 PLA2G2D (0.60) NQO2PLAUMTNR1APTPN11PLA2G2D

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed