SCHEMBL242196

SCHEMBL242196

c1ccc2c(c1)nnn2N1CCOCC1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP2D6 P10635 2/20 0.60
HTT P42858 3/20 0.48
LMNA P02545 3/20 0.48
KDM4E B2RXH2 2/20 0.48
ALDH1A1 P00352 2/20 0.48
MAPT P10636 2/20 0.48
APAF1 O14727 1/20 0.48
NPC1 O15118 1/20 0.48
TDP2 O95551 1/20 0.48
THRB P10828 1/20 0.48
HPGD P15428 1/20 0.48
BLM P54132 1/20 0.48
SMAD3 P84022 1/20 0.48
SMN1; SMN2 Q16637 1/20 0.48
HKDC1 Q2TB90 1/20 0.48
NPSR1 Q6W5P4 1/20 0.48
TDP1 Q9NUW8 1/20 0.48
MEN1 O00255 1/20 0.43
KMT2A Q03164 1/20 0.43
POLB P06746 3/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20710852 0.87 SLC9A1 (0.50) CYP2D6ALDH1A1MAPTHPGDNPSR1
SCHEMBL30518786 0.84 MAPK1 (0.49) CYP2D6ALDH1A1MAPTHPGDNPSR1
SCHEMBL2203699 0.82 MAPK1 (0.51) CYP2D6LMNAALDH1A1MAPTNPSR1
SCHEMBL14523152 0.80 FAAH (0.56) CYP2D6HTTLMNAKDM4EALDH1A1
SCHEMBL14516380 0.79 CYP2D6 (0.47) CYP2D6HTTLMNAKDM4EALDH1A1
Molinazone SCHEMBL122544 0.78 SMN1; SMN2 (0.45) CYP2D6HTTLMNAKDM4EALDH1A1
Molinazone SCHEMBL30496121 0.78 SMN1; SMN2 (0.45) CYP2D6HTTLMNAKDM4EALDH1A1
SCHEMBL3072391 0.77 SLC9A1 (0.60) CYP2D6ALDH1A1MAPTNPC1HPGD
SCHEMBL2491350 0.76 CYP2D6 (1.00) CYP2D6HTTLMNAKDM4EALDH1A1
SCHEMBL14523170 0.74 SLC9A1 (0.46) CYP2D6ALDH1A1MAPTMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-6085455-A None JP disclosed
JP-6085417-A None JP disclosed
US-20230203347-A1 METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET, AND PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2023-06-29 US disclosed
EP-4130182-A1 METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET, AND PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2023-02-08 EP disclosed
CN-115397936-A Method for producing adhesive sheet and adhesive sheet 日东电工株式会社 2022-11-25 CN disclosed
EP-1679361-B1 CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD WAKO PURE CHEM IND LTD (JP) 2015-06-24 EP disclosed
US-8900371-B2 Cleaning agent for substrate and cleaning method WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2014-12-02 US disclosed
US-20120000485-A1 CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2012-01-05 US disclosed
US-20070235061-A1 Cleaning Agent for Substrate and Cleaning Method WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2007-10-11 US disclosed
EP-1679361-A1 CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD Wako Pure Chemical Industries, Ltd. (JP) 2006-07-12 EP disclosed
JP-H0685417-A SURFACE TREATMENT METHOD FOR COPPER FOIL USED FOR PRINTED CIRCUIT NIKKO GUURUDO FOIL KK 1994-03-25 JP disclosed
JP-H0685455-A SURFACE TREATMENT OF COPPER FOIL FOR PRINTED CIRCUIT USE NIKKO GUURUDO FOIL KK 1994-03-25 JP disclosed