SCHEMBL24254787

SCHEMBL24254787

Nc1cc(N)c(C(F)(F)F)c(C(F)(F)F)c1N

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.37
KDM4E B2RXH2 1/20 0.37
MEN1 O00255 1/20 0.37
USP2 O75604 1/20 0.37
HSP90AA1 P07900 1/20 0.37
HSP90AB1 P08238 1/20 0.37
MAPT P10636 1/20 0.37
THRB P10828 1/20 0.37
G6PD P11413 1/20 0.37
ALOX15 P16050 1/20 0.37
CASP1 P29466 1/20 0.37
KMT2A Q03164 1/20 0.37
HSD17B10 Q99714 1/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
PTK2 Q05397 1/20 0.35
CA2 P00918 1/20 0.33
CHKA P35790 1/20 0.33
TSHR P16473 2/20 0.30
GLA P06280 1/20 0.30
POLB P06746 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7951211 0.84 ALDH1A1 (0.37) ALDH1A1KDM4EMEN1USP2HSP90AA1
SCHEMBL13385821 0.80 CA2 (0.39) ALDH1A1KDM4EMEN1USP2HSP90AA1
SCHEMBL29725319 0.80 CA12 (0.39) ALDH1A1KDM4EMEN1USP2HSP90AA1
SCHEMBL29620303 0.80 CA2 (0.39) ALDH1A1KDM4EMEN1USP2HSP90AA1
SCHEMBL9142584 0.73 ALDH1A1 (0.32) ALDH1A1
SCHEMBL7869985 0.73
SCHEMBL28577674 0.72 NR4A1 (0.42) ALDH1A1KDM4EMEN1USP2HSP90AA1
SCHEMBL27082422 0.72 CA2 (0.41) ALDH1A1KDM4EMEN1USP2HSP90AA1
SCHEMBL29620304 0.71 KIF11 (0.36) ALDH1A1KDM4EMEN1USP2HSP90AA1
SCHEMBL6313808 0.71 KIF11 (0.36) ALDH1A1KDM4EMEN1USP2HSP90AA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4198163-A1 METAL PATTERNING MATERIAL, AMINE COMPOUND, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN Tosoh Corporation (JP) 2023-06-21 EP disclosed
WO-2022034907-A1 METAL PATTERNING MATERIAL, AMINE COMPOUND, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN 東ソー株式会社 2022-02-17 WO disclosed