SCHEMBL24254914

SCHEMBL24254914

Nc1cc(N)c(-c2ccc(-c3ccccc3)cc2)c(N)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 4/20 0.56
TAAR1 Q96RJ0 3/20 0.56
CYP3A4 P08684 2/20 0.56
TDP1 Q9NUW8 2/20 0.56
MAOA P21397 1/20 0.50
ALDH1A1 P00352 7/20 0.48
MAPT P10636 5/20 0.48
HPGD P15428 3/20 0.48
KDM4E B2RXH2 2/20 0.48
MEN1 O00255 2/20 0.48
ALOX15 P16050 2/20 0.48
KMT2A Q03164 2/20 0.48
LMNA P02545 2/20 0.48
HTT P42858 2/20 0.48
USP2 O75604 1/20 0.48
HSP90AA1 P07900 1/20 0.48
GAA P10253 1/20 0.48
ALOX12 P18054 1/20 0.48
IKBKB O14920 1/20 0.42
NPC1 O15118 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28153334 0.95 MAOA (0.48) HSD17B10TAAR1CYP3A4TDP1MAOA
SCHEMBL25135346 0.85 MAPT (0.52) HSD17B10TAAR1CYP3A4TDP1MAOA
SCHEMBL29172201 0.85 ATM (0.41) HSD17B10TAAR1CYP3A4TDP1MAOA
SCHEMBL25135347 0.82 HSD17B10 (0.48) HSD17B10TAAR1CYP3A4TDP1MAOA
SCHEMBL28779538 0.81 KMT2A (0.49) HSD17B10TAAR1CYP3A4TDP1ALDH1A1
SCHEMBL18678323 0.77 HSD17B10 (0.65) HSD17B10TAAR1CYP3A4TDP1MAOA
SCHEMBL13486729 0.77 HSD17B10 (0.65) HSD17B10TAAR1CYP3A4TDP1MAOA
SCHEMBL16519820 0.77 HSD17B10 (0.65) HSD17B10TAAR1CYP3A4TDP1MAOA
SCHEMBL24129913 0.77 ACHE (0.45) HSD17B10TAAR1CYP3A4TDP1MAOA
SCHEMBL2336893 0.76 ACHE (0.48) HSD17B10CYP3A4TDP1ALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022034907-A1 METAL PATTERNING MATERIAL, AMINE COMPOUND, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN 東ソー株式会社 2022-02-17 WO disclosed