SCHEMBL24254922

SCHEMBL24254922

Nc1cccc(-c2cc(N)c(N)cc2-c2cccc(N)c2)c1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOA P21397 1/20 0.58
MAP4K4 O95819 4/20 0.53
CYP3A4 P08684 1/20 0.52
CASP1 P29466 1/20 0.52
RECQL P46063 1/20 0.52
MAPT P10636 2/20 0.49
MEN1 O00255 2/20 0.47
PSIP1 O75475 1/20 0.47
AXL P30530 1/20 0.47
MKNK1 Q9BUB5 1/20 0.47
MKNK2 Q9HBH9 1/20 0.47
BRD4 O60885 1/20 0.44
ALDH1A1 P00352 3/20 0.44
CA12 O43570 2/20 0.44
CA1 P00915 2/20 0.44
CA2 P00918 2/20 0.44
CA9 Q16790 2/20 0.44
MECP2 P51608 1/20 0.44
KDM4E B2RXH2 1/20 0.44
LMNA P02545 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6575802 0.87 MAOA (0.50) MAOAMAP4K4CYP3A4CASP1RECQL
SCHEMBL25632272 0.85 MAOA (0.48) MAOAMAP4K4CYP3A4CASP1RECQL
SCHEMBL25632076 0.83 MAOA (0.56) MAOAMAP4K4CYP3A4CASP1RECQL
SCHEMBL29471388 0.82 MAOA (0.68) MAOAMAP4K4CYP3A4CASP1RECQL
SCHEMBL2023695 0.82 MAOA (0.68) MAOAMAP4K4CYP3A4CASP1RECQL
SCHEMBL29636990 0.81 ALDH1A1 (0.62) MAOAMAP4K4CYP3A4CASP1RECQL
SCHEMBL2442638 0.81 ALDH1A1 (0.62) MAOAMAP4K4CYP3A4CASP1RECQL
SCHEMBL31607638 0.81 ALDH1A1 (0.62) MAOAMAP4K4CYP3A4CASP1RECQL
SCHEMBL30839741 0.81 ALDH1A1 (0.62) MAOAMAP4K4CYP3A4CASP1RECQL
SCHEMBL6011321 0.81 MAOA (0.54) MAOAMAP4K4CYP3A4CASP1RECQL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022034907-A1 METAL PATTERNING MATERIAL, AMINE COMPOUND, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN 東ソー株式会社 2022-02-17 WO disclosed