SCHEMBL242873

SCHEMBL242873

CC(CN(C(P(=O)(O)O)P(=O)(O)O)C(P(=O)(O)O)P(=O)(O)O)N(C(P(=O)(O)O)P(=O)(O)O)C(P(=O)(O)O)P(=O)(O)O

nearest known ligand 0.41

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
FDPS P14324 2/20 0.41
ANPEP P15144 4/20 0.35
LAP3 P28838 3/20 0.35
ERAP1 Q9NZ08 1/20 0.35
CA12 O43570 1/20 0.31
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
CA9 Q16790 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3615575 0.76 FDPS (0.43) FDPSANPEPLAP3ERAP1
SCHEMBL10634337 0.76 ALDH1A1 (0.43) FDPSANPEPLAP3ERAP1
SCHEMBL2468885 0.76 FDPS (0.45) FDPSANPEPLAP3ERAP1
SCHEMBL8644881 0.75 FDPS (0.43) FDPSLAP3
SCHEMBL8611952 0.74 FDPS (0.37) FDPSANPEPLAP3ERAP1
SCHEMBL15409829 0.74 FDPS (0.37) FDPS
SCHEMBL15409669 0.74 FDPS (0.37) FDPS
SCHEMBL10706079 0.74 FDPS (0.38) FDPS
SCHEMBL7897812 0.72 FDPS (0.42) FDPS
SCHEMBL4906845 0.72 FDPS (0.42) FDPS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 104 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230365893-A1 COMPOSITION FOR CLEANING SEMICONDUCTOR SUBSTRATE, AND CLEANING METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-11-16 US claimed
US-20230238251-A1 ETCHING LIQUID FOR TITANIUM AND/OR TITANIUM ALLOY, METHOD FOR ETCHING TITANIUM AND/OR TITANIUM ALLOY WITH USE OF SAID ETCHING LIQUID, AND METHOD FOR PRODUCING SUBSTRATE WITH USE OF SAID ETCHING LIQUID MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-07-27 US claimed
EP-4207250-A1 COMPOSITION FOR CLEANING SEMICONDUCTOR SUBSTRATE, AND CLEANING METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-07-05 EP claimed
US-10570522-B2 Etching solution for copper or copper alloy ENTEGRIS, INC. (US) 2020-02-25 US claimed
EP-2927937-B1 CLEANING LIQUID FOR SEMICONDUCTOR ELEMENTS AND CLEANING METHOD USING SAME MITSUBISHI GAS CHEMICAL CO (JP) 2018-01-03 EP claimed
US-9790600-B2 Etching agent for copper or copper alloy ENTEGRIS, INC. (US) 2017-10-17 US claimed
US-20160053383-A1 ETCHING AGENT FOR COPPER OR COPPER ALLOY SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-02-25 US claimed
US-9175404-B2 Etching agent for copper or copper alloy ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2015-11-03 US claimed
EP-1679361-B1 CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD WAKO PURE CHEM IND LTD (JP) 2015-06-24 EP claimed
US-8900371-B2 Cleaning agent for substrate and cleaning method WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2014-12-02 US claimed
US-8614175-B2 Cleaning solution composition for a solar cell DONGWOO FINE-CHEM CO., LTD. (KR) 2013-12-24 US claimed
US-20130270217-A1 ETCHING SOLUTION FOR COPPER OR COPPER ALLOY ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2013-10-17 US claimed
US-20120090670-A1 CLEANING SOLUTION COMPOSITION FOR A SOLAR CELL DONGWOO FINE-CHEM CO., LTD. (KR) 2012-04-19 US claimed
US-20070235061-A1 Cleaning Agent for Substrate and Cleaning Method WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2007-10-11 US claimed
EP-1679361-A1 CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD Wako Pure Chemical Industries, Ltd. (JP) 2006-07-12 EP claimed
US-6495096-B1 DEODORANT FOR SUBSTANCES CONTAINING AT LEAST ONE OF HYDROGEN SULFIDE AND MERCAPTANS WHICH COMPRISES COMBINATION OF PEROXIDE, CHELATING AGENT AND NITRATE ION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2002-12-17 US claimed
EP-0560324-B1 Cleaning fluid for semiconductor substrate MITSUBISHI GAS CHEMICAL CO (JP) 1998-08-19 EP claimed
US-5705089-A HYDROGEN PEROXIDE, PHOSPHONIC ACID CHELATEING AGENT, WETTING AGENT MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1998-01-06 US claimed
EP-0528053-B1 CLEANING LIQUID FOR SEMICONDUCTOR SUBSTRATE MITSUBISHI GAS CHEMICAL CO (JP) 1996-01-03 EP claimed
EP-0560324-A1 Cleaning fluid for semiconductor substrate MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1993-09-15 EP claimed