Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | OPRM1 | P35372 | 1/20 | 0.32 |
| ▸ | OPRD1 | P41143 | 1/20 | 0.32 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31410770 | 1.00 | OPRM1 (0.32) | OPRM1OPRD1OPRK1 | |
| SCHEMBL22182531 | 0.96 | OPRM1 (0.33) | OPRM1OPRD1OPRK1 | |
| SCHEMBL23449016 | 0.91 | — | — | |
| SCHEMBL23142718 | 0.89 | — | — | |
| SCHEMBL21795511 | 0.87 | — | — | |
| SCHEMBL11104322 | 0.86 | ALDH1A1 (0.33) | — | |
| SCHEMBL19543775 | 0.85 | — | — | |
| SCHEMBL19543776 | 0.85 | — | — | |
| SCHEMBL16640954 | 0.85 | SMN1; SMN2 (0.35) | — | |
| SCHEMBL130374 | 0.84 | ALOX5 (0.36) | OPRM1OPRD1OPRK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2989 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122080828-A | High-temperature-resistant adhesive capable of being cured at medium temperature, high-insulation packaging material and preparation method thereof | — | 2026-05-26 | — | — | CN | claimed |
| US-12612537-B2 | Thermosetting adhesive sheet and sub-gasket for fuel cell | HIGASHIYAMA FILM CO., LTD. (JP) | 2026-04-28 | — | — | US | claimed |
| US-12606481-B2 | Sizing compositions for glass fiber direct roving for producing multiaxial fabrics, and preparation methods and applications thereof | JUSHI GROUP CO., LTD. (CN) | 2026-04-21 | — | — | US | claimed |
| US-12577439-B2 | Multilayer adhesive tape | TESA SE (DE) | 2026-03-17 | — | — | US | claimed |
| EP-4574916-A1 | PRESSURE SENSITIVE ADHESIVE | TESA SE (DE) | 2025-06-25 | — | — | EP | claimed |
| CN-120134717-A | High-strength honeycomb paper core cover plate and preparation process thereof | 常熟新常泰汽车内饰科技有限公司 | 2025-06-13 | — | — | CN | claimed |
| CN-120041122-A | Epoxy resin underfill adhesive and preparation method thereof | 深圳先进电子材料国际创新研究院 | 2025-05-27 | — | — | CN | claimed |
| CN-120041219-A | Liquid crystal aligning agent, liquid crystal alignment film, method for producing liquid crystal alignment film, liquid crystal element, and method for producing liquid crystal element | JSR株式会社 | 2025-05-27 | — | — | CN | claimed |
| CN-119978848-A | Encapsulated pigment and preparation method and application thereof | 珠海传美讯新材料股份有限公司 | 2025-05-13 | — | — | CN | claimed |
| CN-115850663-B | Pre-embedded-bionic grafted organic amine polymer, preparation method and application | 绵阳华远同创科技有限公司 | 2025-05-09 | — | — | CN | claimed |
| EP-1528091-B1 | A pressure-sensitive adhesive tape | NITTO EUROPE NV (BE) | 2007-07-25 | — | — | EP | claimed |
| US-20060079609-A1 | Heat curable resin composition having a low elastic modulus, heat curable film using same, and cured products | JSR CORPORATION (JP) | 2006-04-13 | — | — | US | claimed |
| EP-1528091-A1 | A pressure-sensitive adhesive tape | NITTO EUROPE N.V (BE) | 2005-05-04 | — | — | EP | claimed |
| EP-0606500-B1 | THERMOSETTING RESIN COMPOSITION AND PRODUCTION OF COPPER-CLAD LAMINATED BOARD THEREFROM | SHOWA HIGHPOLYMER (JP) | 1997-06-04 | — | — | EP | claimed |
| US-5599629-A | EPOXY RESIN HAVING AT LEAST ONE GLYCIDYL AMINE GROUP AND THREE OR MORE EPOXIDE GROUPS PER MOLECULE, AROMATIC AMINE HARDENER SUBSTITUTED WITH ELECTRON WITHDRAWING GROUP IN SPECIFIED STOICHIOMETRY | AMOCO CORPORATION (US) | 1997-02-04 | — | — | US | claimed |
| US-5439986-A | Thermo-curable resin composition, and a method for producing a copper-clad laminate using same | SHOWA HIGHPOLYMER CO., LTD. (JP) | 1995-08-08 | — | — | US | claimed |
| EP-0606500-A1 | THERMOSETTING RESIN COMPOSITION AND PRODUCTION OF COPPER-CLAD LAMINATED BOARD THEREFROM | SHOWA HIGHPOLYMER CO., LTD. (JP) | 1994-07-20 | — | — | EP | claimed |
| US-5049631-A | Heat resistant | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1991-09-17 | — | — | US | claimed |
| US-4722816-A | HAVING FILLER SURFACE TREATED WITH EPOXY COMPOUND; PLASMA TREATED | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1988-02-02 | — | — | US | claimed |
| EP-0202635-A2 | A method for the preparation of shaped articles of a vinyl chloride-based resin having improved surface properties | Shin-Etsu Chemical Co., Ltd. (JP) | 1986-11-26 | — | — | EP | claimed |