SCHEMBL2435895

SCHEMBL2435895

Cc1cccc2c1[PH](=O)Oc1ccccc1-2

nearest known ligand 0.38

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MYC P01106 1/20 0.36
NPC1 O15118 1/20 0.32
CASP3 P42574 1/20 0.32
RAB9A P51151 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
SENP8 Q96LD8 1/20 0.32
SENP7 Q9BQF6 1/20 0.32
SENP6 Q9GZR1 1/20 0.32
HTR7 P34969 1/20 0.32
ACHE P22303 2/20 0.32
KDM4E B2RXH2 3/20 0.32
MAPK1 P28482 1/20 0.32
ATM Q13315 1/20 0.32
TSHR P16473 1/20 0.31
CYP1A2 P05177 1/20 0.31
CYP2C19 P33261 1/20 0.31
HSP90AA1 P07900 1/20 0.31
NOTUM Q6P988 1/20 0.30
DAO P14920 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7108192 0.80 ACHE (0.33) MYCACHEDAO
SCHEMBL28051577 0.79 PKM (0.32) KDM4EMAPK1ATMTSHRHSP90AA1
SCHEMBL30172459 0.79 HDAC3 (0.35) NPC1RAB9ASMN1; SMN2KDM4EMAPK1
SCHEMBL30688091 0.79 PDCD1 (0.33) KDM4EMAPK1ATMHSP90AA1
SCHEMBL28619413 0.79 MAPK1 (0.32) KDM4EMAPK1ATMHSP90AA1
SCHEMBL27930711 0.79 AHR (0.36) NPC1RAB9ASMN1; SMN2KDM4EMAPK1
SCHEMBL20873668 0.77 PKM (0.32) KDM4EMAPK1ATMTSHRHSP90AA1
SCHEMBL16469668 0.76 KDM4E (0.30) KDM4EMAPK1ATM
SCHEMBL25389351 0.75 HDAC3 (0.38) SMN1; SMN2KDM4EMAPK1TSHRCYP2C19
SCHEMBL14059720 0.75 PDCD1 (0.38) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111072925-A Flame-retardant epoxy resin curing agent and preparation method thereof 南京中赢纳米新材料有限公司 2020-04-28 CN claimed
CN-111072925-A Flame-retardant epoxy resin curing agent and preparation method thereof 南京中赢纳米新材料有限公司 2020-04-28 CN disclosed
US-8592071-B2 Laminated porous film and separator for battery MITSUBISHI PLASTICS, INC. (JP) 2013-11-26 US disclosed
US-20110212358-A1 LAMINATED POROUS FILM AND SEPARATOR FOR BATTERY MITSUBISHI PLASTICS, INC. (JP) 2011-09-01 US disclosed
EP-1016688-B1 Aromatic polycarbonate composition MITSUBISHI GAS CHEMICAL CO (JP) 2003-09-24 EP disclosed
US-6187896-B1 CONTAINS PHOSPHORUS COMPOUND HEAT STABILIZER MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2001-02-13 US disclosed
EP-1016688-A2 Aromatic polycarbonate composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2000-07-05 EP disclosed
EP-0790262-B1 PROPYLENE-ETHYLENE COPOLYMER COMPOSITIONS AND PROCESS FOR THE PRODUCTION THEREOF CHISSO CORP (JP) 2000-05-10 EP disclosed
US-6005034-A POLYMER MELTS OF ETHYLENE-PROPYLENE COPOLYMERS CHISSO CORPOATION (JP) 1999-12-21 US disclosed
EP-0790262-A1 PROPYLENE-ETHYLENE COPOLYMER COMPOSITIONS AND PROCESS FOR THE PRODUCTION THEREOF CHISSO CORPORATION (JP) 1997-08-20 EP disclosed