Propylene Glycol

Propylene Glycol

SCHEMBL243616

C=CCOCC=C.CC(=O)O.CC(O)CO

nearest known ligand 0.40

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

SLC5A2

The experimentally established mechanism targets of Propylene Glycol. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.40
CA1 P00915 3/20 0.38
CA2 P00918 3/20 0.38
CA7 P43166 2/20 0.38
USP2 O75604 1/20 0.33
LMNA P02545 1/20 0.33
CYP3A4 P08684 1/20 0.33
MAPT P10636 1/20 0.33
RECQL P46063 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
TSHR P16473 2/20 0.31
CA9 Q16790 2/20 0.31
PAX8 Q06710 1/20 0.31
CA4 P22748 1/20 0.31
MEN1 O00255 1/20 0.31
POLB P06746 1/20 0.31
KMT2A Q03164 1/20 0.31
ALDH1A1 P00352 1/20 0.30
OR51E2 Q9H255 1/20 0.30
AKR1B1 P15121 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Propylene Glycol SCHEMBL27763183 1.00 TDP1 (0.40) TDP1CA1CA2CA7USP2
Methacrylic Acid SCHEMBL5050934 0.91 TDP1 (0.36) TDP1CA1CA2CA7USP2
Propylene Glycol SCHEMBL278652 0.89 TDP1 (0.50) TDP1CA1CA2CA7LMNA
Propylene Glycol SCHEMBL460713 0.89 TDP1 (0.37) TDP1CA1CA2CA7TSHR
Glycerin SCHEMBL27608711 0.88 CA1 (0.42) TDP1CA1CA2CA7USP2
Glycerin SCHEMBL11754257 0.88 CA1 (0.42) TDP1CA1CA2CA7USP2
Propylene Glycol SCHEMBL8520043 0.85 TDP1 (0.46) TDP1CA1CA2CA7LMNA
Acetic Acid SCHEMBL131569 0.85 FFAR3 (0.39) TDP1CA1CA2CA7LMNA
Acetic Acid SCHEMBL27627871 0.85 FFAR3 (0.39) TDP1CA1CA2CA7LMNA
Acetic Acid SCHEMBL27951145 0.84 CA1 (0.47) TDP1CA1CA2CA7USP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2137 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118244576-A Photosensitive resin composition and cured film thereof 罗门哈斯电子材料韩国有限公司 2024-06-25 CN claimed
CN-117777455-B Fluorine-containing polysiloxane, preparation method thereof, photoresist composition and application thereof 山东同益光刻胶材料科技有限公司 2024-05-10 CN claimed
CN-117777455-A Fluorine-containing polysiloxane, preparation method thereof, photoresist composition and application thereof 山东同益光刻胶材料科技有限公司 2024-03-29 CN claimed
US-11920069-B2 Compositions containing semiconducting nanoparticles, and polymer or composite layers formed therefrom, and optical devices MERCK PATENT GMBH (DE) 2024-03-05 US claimed
CN-117624471-A Photoresist film-forming resin and preparation method thereof 广东粤港澳大湾区黄埔材料研究院 2024-03-01 CN claimed
CN-117106128-A Fluorine-containing acrylate polymer, preparation method thereof, fluorinated polymer photoresist material and application thereof 吉林大学 2023-11-24 CN claimed
US-20230343582-A1 SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-10-26 US claimed
CN-115785455-B Polyphosphate film-forming resin and photoresist composition 广东粤港澳大湾区黄埔材料研究院 2023-10-10 CN claimed
US-11746284-B2 Composition comprising a semiconducting light emitting nanoparticle MERCK PATENT GMBH (DE) 2023-09-05 US claimed
US-11728161-B2 Spin on carbon composition and method of manufacturing a semiconductor device TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-08-15 US claimed
EP-0416873-A2 Transparent dissolution rate modifiers for photoresists HOECHST CELANESE CORPORATION (US) 1991-03-13 EP claimed
EP-0410794-A2 Maleimide containing, negative working deep UV photoresist HOECHST CELANESE CORPORATION (US) 1991-01-30 EP claimed
EP-0220645-B1 PHOTOSENSITIVE POSITIVE COMPOSITION AND PHOTORESIST MATERIAL PREPARED THEREWITH HOECHST CELANESE CORPORATION (US) 1990-09-12 EP claimed
US-4948697-A IMPROVED ODOR AND INCREASED PHTOSPEED HOECHST CELANESE CORPORATION (US) 1990-08-14 US claimed
US-4931381-A Image reversal negative working O-quinone diazide and cross-linking compound containing photoresist process with thermal curing treatment HOECHST CELANESE CORPORATION (US) 1990-06-05 US claimed
EP-0221428-B1 LIQUID FOR THE TREATMENT OF A PHOTORESIST COMPOSITION, AND PROCESS THEREFOR HOECHST CELANESE CORPORATION (US) 1989-11-23 EP claimed
US-4863827-A O-QUINONE DIAZIDE AMERICAN HOECHST CORPORATION (US) 1989-09-05 US claimed
EP-0226741-B1 PROCESS FOR PRODUCING A POSITIVE PHOTORESIST HOECHST CELANESE CORPORATION (US) 1989-08-02 EP claimed
EP-0260994-A2 Process for producing integrated circuit JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1988-03-23 EP claimed
US-4550069-A PHOTOSPEED INCREASED AMERICAN HOECHST CORPORATION (US) 1985-10-29 US claimed