Propylene Glycol

Propylene Glycol

SCHEMBL460713

C=CCOCC=C.CC(O)CO.CCC(=O)O

nearest known ligand 0.37

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

SLC5A2

The experimentally established mechanism targets of Propylene Glycol. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.37
FFAR3 O14843 1/20 0.37
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
CA7 P43166 1/20 0.36
TSHR P16473 2/20 0.33
MEN1 O00255 1/20 0.32
POLB P06746 1/20 0.32
KMT2A Q03164 1/20 0.32
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Propylene Glycol SCHEMBL27763183 0.89 TDP1 (0.40) TDP1CA1CA2CA7TSHR
Propylene Glycol SCHEMBL243616 0.89 TDP1 (0.40) TDP1CA1CA2CA7TSHR
Propylene Glycol SCHEMBL8520043 0.86 TDP1 (0.46) TDP1CA1CA2CA7TSHR
Propionic Acid SCHEMBL3430108 0.86 FFAR3 (0.50) TDP1FFAR3CA1CA2CA7
Propylene Glycol SCHEMBL278652 0.86 TDP1 (0.50) TDP1CA1CA2CA7TSHR
Propionic Acid SCHEMBL27738270 0.85 CA1 (0.44) TDP1FFAR3CA1CA2CA7
Propionic Acid SCHEMBL1903683 0.84 FFAR3 (0.43) TDP1FFAR3CA1CA2CA7
Methacrylic Acid SCHEMBL5050934 0.84 TDP1 (0.36) TDP1CA1CA2CA7TSHR
Propylene Glycol SCHEMBL28074364 0.82 TSHR (0.38) TDP1FFAR3TSHR
SCHEMBL27593847 0.81 CA1 (0.36) TDP1CA1CA2CA7TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 219 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115291472-A Negative photoresist composition and spacer formed therefrom 漳州思美科新材料有限公司 2022-11-04 CN claimed
CN-115167078-A Positive photoresist composition, cured film and synthesis method thereof 漳州思美科新材料有限公司 2022-10-11 CN claimed
CN-104007616-B Photosensitive resin composition and display device using the same 三星显示有限公司 2022-01-28 CN claimed
CN-106896644-B Photosensitive resin composition and application thereof 青岛蓝帆新材料有限公司 2020-05-08 CN claimed
CN-106909024-B Photosensitive resin composition and application thereof 辽宁靖帆新材料有限公司 2020-03-13 CN claimed
US-20140240645-A1 PHOTOSENSITIVE RESIN COMPOSITION, DISPLAY DEVICE USING THE SAME AND METHOD OF MANUFACTURING THE DISPLAY DEVICE SAMSUNG DISPLAY CO., LTD. (KR) 2014-08-28 US claimed
US-8492459-B2 Ink composition and method of forming a pattern using the same LG DISPLAY CO., LTD. (KR) 2013-07-23 US claimed
US-20120064455-A1 PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME SAMSUNG TECHWIN CO., LTD. (KR) 2012-03-15 US claimed
US-20090176936-A1 Ink composition and method of forming a pattern using the same LG DISPLAY CO., LTD. (KR) 2009-07-09 US claimed
JP-8179500-A None JP disclosed
JP-8195337-A None JP disclosed
JP-8179499-A None JP disclosed
WO-2024147537-A1 RESIN COMPOSITION FOR ANTI-REFLECTION FILM, ANTI-REFLECTION FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2024-07-11 WO disclosed
CN-111240157-B Positive photosensitive resin composition and cured film prepared therefrom 罗门哈斯电子材料韩国有限公司 2024-07-09 CN disclosed
US-6379860-B1 RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE FUJI PHOTO FILM CO., LTD. (JP) 2002-04-30 US disclosed
EP-1193557-A1 Use of a radiation sensitive resin composition for the formation of cathode separator, cathode separator and electroluminescent display device JSR Corporation (JP) 2002-04-03 EP disclosed
EP-1057859-A2 Radiation sensitive resin composition and use of the same in an interlaminar insulating film JSR Corporation (JP) 2000-12-06 EP disclosed
JP-H08195337-A SOLVENT FOR CLEANING AND REMOVING RESIST FUJI PHOTO FILM CO LTD 1996-07-30 JP disclosed
JP-H08179499-A POSITIVE TYPE RESIST SOLUTION JAPAN SYNTHETIC RUBBER CO LTD 1996-07-12 JP disclosed
JP-H08179500-A CHEMICAL AMPLIFICATION TYPE RESIST SOLUTION JAPAN SYNTHETIC RUBBER CO LTD 1996-07-12 JP disclosed