SCHEMBL24390652

SCHEMBL24390652

O=C=Nc1ccc(Nc2nc(Nc3ccc(C=O)cc3)nc(Nc3ccc(N=C=O)cc3)n2)cc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CYP3A4 P08684 1/20 0.42
▸ TSHR P16473 1/20 0.42
▸ DDX3X O00571 3/20 0.40
▸ CA1 P00915 12/20 0.36
▸ CA2 P00918 12/20 0.36
▸ CA9 Q16790 12/20 0.36
▸ CA12 O43570 11/20 0.36
▸ MAPT P10636 3/20 0.36
▸ MEN1 O00255 2/20 0.35
▸ KMT2A Q03164 2/20 0.35
▸ HTT P42858 1/20 0.35
▸ NPSR1 Q6W5P4 1/20 0.35
▸ ALDH1A1 P00352 1/20 0.33
▸ MAPK1 P28482 1/20 0.33
▸ SMN1; SMN2 Q16637 1/20 0.33
▸ CA4 P22748 1/20 0.33
▸ CA6 P23280 1/20 0.33
▸ CA5A P35218 1/20 0.33
▸ CA7 P43166 1/20 0.33
▸ CA13 Q8N1Q1 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3384405 0.80 CYP3A4 (0.60) CYP3A4TSHRALDH1A1MAPK1
SCHEMBL4581190 0.76 CYP3A4 (0.54) CYP3A4TSHRMAPTMEN1KMT2A
SCHEMBL24390655 0.76 CA1 (0.38) DDX3XCA1CA2CA9CA12
SCHEMBL23868900 0.76 ALDH5A1 (0.59) DDX3XCA9MAPTMEN1KMT2A
SCHEMBL21908188 0.75 CYP3A4 (0.54) CYP3A4TSHRALDH1A1MAPK1
SCHEMBL21908466 0.75 CYP3A4 (0.54) CYP3A4TSHRALDH1A1MAPK1
SCHEMBL7761166 0.75 CYP3A4 (0.54) CYP3A4TSHRALDH1A1MAPK1
SCHEMBL4572353 0.73 NFKB1 (0.58) CA1CA2CA9CA12MAPT
SCHEMBL24390656 0.72 ALDH1A1 (0.63) MAPTMEN1KMT2AALDH1A1SMN1; SMN2
SCHEMBL23868902 0.72 ALDH5A1 (0.44) DDX3XCA1CA2CA9CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220135861-A1 COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, AND SURFACE-MODIFIED INORGANIC SUBSTANCE FUJIFILM CORPORATION (JP) 2022-05-05 — — US disclosed
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