SCHEMBL2441745

SCHEMBL2441745

CC(C)(O[SiH3])c1cccc(N)c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 2/20 0.50
TSHR P16473 2/20 0.50
CYP3A4 P08684 3/20 0.42
CASP1 P29466 2/20 0.42
RECQL P46063 1/20 0.42
ALDH1A1 P00352 7/20 0.41
TP53 P04637 1/20 0.37
CA12 O43570 1/20 0.35
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
CA7 P43166 1/20 0.35
CA9 Q16790 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
CA14 Q9ULX7 1/20 0.35
MAOB P27338 1/20 0.35
MAOA P21397 1/20 0.34
ALOX15 P16050 2/20 0.33
KDM4E B2RXH2 2/20 0.33
MAPT P10636 2/20 0.33
MEN1 O00255 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28568707 0.83 MAPK1 (0.54) MAPK1TSHRCYP3A4CASP1RECQL
SCHEMBL29472201 0.80 ALDH1A1 (0.57) MAPK1TSHRCYP3A4CASP1RECQL
SCHEMBL28330942 0.80 ALDH1A1 (0.57) MAPK1TSHRCYP3A4CASP1RECQL
SCHEMBL29403060 0.76 MAPK1 (0.60) MAPK1TSHRCYP3A4CASP1RECQL
SCHEMBL31476400 0.76 TSHR (0.60) MAPK1TSHRCYP3A4CASP1RECQL
SCHEMBL29374282 0.76 TSHR (0.60) MAPK1TSHRCYP3A4CASP1RECQL
SCHEMBL111419 0.76 MAPK1 (0.60) MAPK1TSHRCYP3A4CASP1RECQL
SCHEMBL125232 0.76 TSHR (0.60) MAPK1TSHRCYP3A4CASP1RECQL
SCHEMBL15735429 0.76 KCNN4 (0.43) MAPK1ALDH1A1TP53ALOX15POLB
SCHEMBL15736194 0.76 TSHR (0.45) MAPK1TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0330456-B1 Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom CHISSO CORP (JP) 1994-09-07 EP claimed
EP-2128193-B1 POROUS POLYIMIDE IBIDEN CO LTD (JP) 2013-06-19 EP disclosed
US-8022110-B2 Porous polyimide IBIDEN CO., LTD. (JP) 2011-09-20 US disclosed
US-7771521-B2 Hyperbranched polyimide-based hybrid material NATIONAL UNIVERSITY CORPORATION NAGOYA INSTITUTE OF TECHNOLOGY (JP) 2010-08-10 US disclosed
EP-1792928-B1 MULTIBRANCHED POLYIMIDE HYBRID MATERIAL NAT UNIV CORP NAGOYA INST TECH (JP) 2010-03-10 EP disclosed
US-20100048745-A1 POROUS POLYIMIDE IBIDEN CO., LTD (JP) 2010-02-25 US disclosed
EP-2128193-A1 POROUS POLYIMIDE Ibiden Co., Ltd. (JP) 2009-12-02 EP disclosed
US-20070149759-A1 HYPERBRANCHED POLYIMIDE-BASED HYBRID MATERIAL IBIDEN CO., LTD (50%) (JP) 2007-06-28 US disclosed
US-6664021-B1 Acid generator and silicon-containing polyimide ester precursor comprising partially esterified silicon-containing polyamic ester; radiating with light CHISSO CORPORATION (JP) 2003-12-16 US disclosed
EP-0601203-B1 PHOTOSENSITIVE RESIN COMPOSITION CHISSO CORP (JP) 1999-09-29 EP disclosed
EP-0456469-A2 Photosensitive heat-resistant polymer having hydroxyphenyl group Chisso Corporation (JP) 1991-11-13 EP disclosed
US-5055549-A Using isoimide intermediate CHISSO CORPORATION (JP) 1991-10-08 US disclosed
US-5026788-A Photosensitive polymer having thiol group CHISSO CORPORATION (JP) 1991-06-25 US disclosed
US-5025088-A Photosensitive poly(amide)imide heat-resistant polymer CHISSO CORPORATION (JP) 1991-06-18 US disclosed
US-4963635-A REACTING A FLUORINE-CONTAINING DIANHYDRIDE OR DIANHYDRIDE, A FLUORINE-CONTAINING DIAMINE OR A DEIAMINE AND AN AMINO-CONTAINING OXYSILANE COMPOUND CHISSO CORPORATION (JP) 1990-10-16 US disclosed
EP-0381506-A2 Silicon polyimide precursor composition Chisso Corporation (JP) 1990-08-08 EP disclosed
EP-0379377-A2 Process for preparing photosensitive heat-resistant polymer Chisso Corporation (JP) 1990-07-25 EP disclosed
EP-0348092-A2 Photosensitive polymer having thiol groups Chisso Corporation (JP) 1989-12-27 EP disclosed
EP-0341028-A2 Process for the preparation of photosensitive polymers Chisso Corporation (JP) 1989-11-08 EP disclosed
EP-0330456-A1 Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom CHISSO CORPORATION (JP) 1989-08-30 EP disclosed