Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.60 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.60 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.52 |
| ▸ | CASP1 | P29466 | 2/20 | 0.52 |
| ▸ | RECQL | P46063 | 1/20 | 0.52 |
| ▸ | ESR1 | P03372 | 3/20 | 0.50 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.43 |
| ▸ | CA12 | O43570 | 1/20 | 0.42 |
| ▸ | CA1 | P00915 | 1/20 | 0.42 |
| ▸ | CA2 | P00918 | 1/20 | 0.42 |
| ▸ | CA7 | P43166 | 1/20 | 0.42 |
| ▸ | CA9 | Q16790 | 1/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.42 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.42 |
| ▸ | MAOA | P21397 | 3/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.39 |
| ▸ | TP53 | P04637 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | MAPT | P10636 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29374282 | 1.00 | TSHR (0.60) | TSHRMAPK1CYP3A4CASP1RECQL | |
| SCHEMBL31476400 | 1.00 | TSHR (0.60) | TSHRMAPK1CYP3A4CASP1RECQL | |
| SCHEMBL29408726 | 0.98 | TSHR (0.58) | TSHRMAPK1CYP3A4CASP1RECQL | |
| SCHEMBL203901 | 0.98 | TSHR (0.58) | TSHRMAPK1CYP3A4CASP1RECQL | |
| SCHEMBL1725375 | 0.95 | ESR1 (0.57) | TSHRMAPK1CYP3A4CASP1RECQL | |
| SCHEMBL126640 | 0.95 | ESR1 (0.57) | TSHRMAPK1CYP3A4CASP1RECQL | |
| SCHEMBL29408725 | 0.95 | ESR1 (0.57) | TSHRMAPK1CYP3A4CASP1RECQL | |
| SCHEMBL27150743 | 0.93 | TSHR (0.54) | TSHRMAPK1CYP3A4CASP1RECQL | |
| SCHEMBL718562 | 0.93 | TSHR (0.54) | TSHRMAPK1CYP3A4CASP1RECQL | |
| SCHEMBL13385785 | 0.91 | ESR1 (0.53) | TSHRMAPK1CYP3A4CASP1RECQL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 961 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260132256-A1 | POLYAMIC ACID COMPOSITION AND POLYIMIDE PREPARED WITH THE SAME | PI ADVANCED MAT CO LTD (KR) | 2026-05-14 | — | — | US | claimed |
| US-20260132262-A1 | BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF | PI ADVANCED MAT CO LTD (KR) | 2026-05-14 | — | — | US | claimed |
| US-20260125577-A1 | SELF-LUBRICATING POLYIMIDE VARNISH AND POLYIMIDE COATING PREPARED THEREFROM | PI ADVANCED MAT CO LTD (KR) | 2026-05-07 | — | — | US | claimed |
| US-20260092194-A1 | POLYIMIDE VARNISH WITH IMPROVED PULSE ENDURANCE AND POLYIMIDE COATING MATERIAL PREPARED THEREOF | PI ADVANCED MAT CO LTD (KR) | 2026-04-02 | — | — | US | claimed |
| EP-4714998-A1 | POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESION AND POLYIMIDE CURED PRODUCT COMPRISING THE SAME | PI Advanced Materials Co., Ltd. (KR) | 2026-03-25 | — | — | EP | claimed |
| US-20260062517-A1 | POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESION AND POLYIMIDE CURED PRODUCT COMPRISING THE SAME | PI ADVANCED MAT CO LTD (KR) | 2026-03-05 | — | — | US | claimed |
| US-20260008935-A1 | POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR | PL ADVANCED MAT CO LTD (KR) | 2026-01-08 | — | — | US | claimed |
| US-12503596-B2 | Low-dielectric-constant polyimide composite powder, and method for producing same | PI ADVANCED MATERIALS CO., LTD. | 2025-12-23 | — | — | US | claimed |
| EP-4626991-A1 | POLYIMIDE VARNISH FOR COATING CONDUCTOR WITH IMPROVED HEAT DISSIPATION FOR COATING CONDUCTOR AND POLYIMIDE COATING MATERIAL COMPRISING THE SAME | PI Advanced Materials Co., Ltd. (KR) | 2025-10-08 | — | — | EP | claimed |
| US-20250230282-A1 | MANUFACTURING METHOD OF POLYIMIDE POWDER AND POLYIMIDE POWDER MANUFACTURED BY THE SAME | PI ADVANCED MAT CO LTD (KR) | 2025-07-17 | — | — | US | claimed |
| WO-2020072639-A1 | A NOVEL AMIDE ACID OLIGOMER PROCESS FOR MOLDING POLYIMIDE COMPOSITES | KANEKA AMERICAS HOLDING, INC. (US) | 2020-04-09 | — | — | WO | claimed |
| US-20180273798-A1 | POLYIMIDE RESIN COMPOSITION AND VARNISH PRODUCED FROM TERMINAL-MODIFIED IMIDE OLIGOMER PREPARED USING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER AND THERMOPLASTIC AROMATIC POLYIMIDE PREPARED USING OXYDIPHTHALIC ACID, POLYIMIDE RESIN COMPOSITION MOLDED ARTICLE AND PREPREG HAVING EXCELLENT HEAT RESISTANCE AND MECHANICAL CHARACTERISTIC, AND FIBER-REINFORCED COMPOSITE MATERIAL THEREOF | KANEKA CORPORATION (JP) | 2018-09-27 | — | — | US | claimed |
| US-10017666-B2 | Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof | KANEKA CORPORATION (JP) | 2018-07-10 | — | — | US | claimed |
| CN-102127375-B | The manufacture method of the attachment structure of circuit connection material, the attachment structure of circuit block and circuit block | 日立化成株式会社 | 2016-09-28 | — | — | CN | claimed |
| US-20130171459-A1 | POLYAMIC ACID RESIN SOLUTION CONTAINING INTERPENETRATING POLYMER AND LAMINATE USING THE SAME | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 2013-07-04 | — | — | US | claimed |
| US-20100218984-A1 | PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD | KANEKA CORPORATION (JP) | 2010-09-02 | — | — | US | claimed |
| US-6468639-B2 | PLATING RESISTANT AND PROTECTIVE INSULATING FILM IS ACHIEVED WITH A COATING MATERIAL OF A SINGLE TYPE OF INSULATING MATERIAL | UBE INDUSTRIES, LTD. (JP) | 2002-10-22 | — | — | US | claimed |
| US-6040418-A | FLUORINATED POLYMIDES COMPRISING UNITS OF 2,2',5,5',6,6'-HEXAFLUOROBIPHENYL-3,3',4,4'-TETRACARBOXYLIC DIANHYDRIDE AND AROMATIC DIAMINE | UBE INDUSTRIES, LTD. (JP) | 2000-03-21 | — | — | US | claimed |
| US-5667899-A | SELF-SUPPORTING BONDING FILM OF POLYIMIDES | HITACHI CHEMICAL CO. LTD. (JP) | 1997-09-16 | — | — | US | claimed |
| US-5605763-A | POLYIMIDE; SEMICONDUCTORS | HITACHI CHEMICAL COMPANY LTD. (JP) | 1997-02-25 | — | — | US | claimed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (6 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260132262-A1 | BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF | PARG, PARN, DYNC1LI1 | TSHR 3181/4885MAPK1 2042/4885CYP3A4 3633/4885 |
| US-20260092194-A1 | POLYIMIDE VARNISH WITH IMPROVED PULSE ENDURANCE AND POLYIMIDE COATING MATERIAL PREPARED THEREOF | SMURF1, TET1, VCL | TSHR 2046/4885MAPK1 2373/4885CYP3A4 4110/4885 |
| US-20260062517-A1 | POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESION AND POLYIMIDE CURED PRODUCT COMPRISING THE SAME | AOC1, AOC2, DDT | TSHR 2535/4885MAPK1 336/4885CYP3A4 4599/4885 |
| US-20260125577-A1 | SELF-LUBRICATING POLYIMIDE VARNISH AND POLYIMIDE COATING PREPARED THEREFROM | CDH1, PBRM1, ITGA1 | TSHR 3634/4885MAPK1 1725/4885CYP3A4 3894/4885 |
| US-20260008935-A1 | POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR | MALT1, CDH1, TET1 | TSHR 2267/4885MAPK1 1991/4885CYP3A4 2008/4885 |
| US-20260132256-A1 | POLYAMIC ACID COMPOSITION AND POLYIMIDE PREPARED WITH THE SAME | PARG, PARN, PUF60 | TSHR 3774/4885MAPK1 1754/4885CYP3A4 4409/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.