SCHEMBL2446922

SCHEMBL2446922

COC(OC)[SiH2]CCSCCN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1228669 0.80
SCHEMBL57613 0.77
SCHEMBL15023851 0.76
SCHEMBL57182 0.75 NFKB1 (0.30)
SCHEMBL11575853 0.75
SCHEMBL56327 0.71 NFKB1 (0.33)
SCHEMBL331418 0.71
SCHEMBL16892642 0.70 DNM1 (0.36)
SCHEMBL28575056 0.70 DNM1 (0.36)
Hydrochloric Acid SCHEMBL29245537 0.68 DNM1 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2128193-B1 POROUS POLYIMIDE IBIDEN CO LTD (JP) 2013-06-19 EP disclosed
US-8022110-B2 Porous polyimide IBIDEN CO., LTD. (JP) 2011-09-20 US disclosed
US-20100048745-A1 POROUS POLYIMIDE IBIDEN CO., LTD (JP) 2010-02-25 US disclosed
EP-2128193-A1 POROUS POLYIMIDE Ibiden Co., Ltd. (JP) 2009-12-02 EP disclosed
EP-0844283-B1 Curable resin composition and cured products JSR CORP (JP) 2002-10-09 EP disclosed
US-6313233-B1 CAN BE CURED AND FABRICATED WITHOUT PRODUCING NO CRACKS INTO A CURED PRODUCT SUCH AS A SEMICONDUCTOR DEVICE HAVING A LOW DIELECTRIC CONSTANT, HIGH HEAT RESISTANCE AND MOISTURE RESISTANCE, SUPERIOR ADHESION TO VARIOUS SUBSTRATE MATERIALS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 2001-11-06 US disclosed
US-6011123-A ORGANOSILANE COMPOUND; POLYAMIC ACIDS HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH, AND POLYIMIDES HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH. JSR CORPORATION (JP) 2000-01-04 US disclosed
EP-0844283-A1 Curable resin composition and cured products JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-05-27 EP disclosed