SCHEMBL2449724

SCHEMBL2449724

Oc1ccc(-c2ccc(OCC3CO3)cc2)cc1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.59
ALDH1A1 P00352 4/20 0.56
TP53 P04637 3/20 0.56
TSHR P16473 3/20 0.56
HIF1A Q16665 3/20 0.56
MEN1 O00255 3/20 0.56
KMT2A Q03164 3/20 0.56
MAPT P10636 2/20 0.56
HPGD P15428 2/20 0.56
PKM P14618 2/20 0.56
CYP1A2 P05177 2/20 0.56
LMNA P02545 2/20 0.56
PPARG P37231 1/20 0.56
GAA P10253 1/20 0.56
CYP3A4 P08684 1/20 0.53
SMN1; SMN2 Q16637 1/20 0.53
ESR2 Q92731 2/20 0.42
GLA P06280 1/20 0.42
CHRNB4 P30926 1/20 0.42
CHRNA3 P32297 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2446420 0.94 TDP1 (0.66) TDP1ALDH1A1TP53TSHRHIF1A
Ethane SCHEMBL4436620 0.91 ALDH1A1 (0.62) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL49248 0.91 TDP1 (0.70) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL21202704 0.91 TDP1 (0.70) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL2720991 0.91 TDP1 (0.70) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL18535692 0.91 TDP1 (0.70) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL14640884 0.91 TDP1 (0.70) TDP1ALDH1A1TP53TSHRHIF1A
Water SCHEMBL11032953 0.89 TDP1 (0.68) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL7576096 0.86 TDP1 (0.56) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL2449880 0.86 PRKAB2 (0.46) TDP1ALDH1A1TP53TSHRHIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-8253555-A None JP disclosed
JP-5063114-A None JP disclosed
WO-2025031932-A1 VINYL ESTER RESIN COMPOSITIONS SCOTT BADER COMPANY LIMITED (GB) 2025-02-13 WO disclosed
EP-2692526-B1 MULTILAYER RESIN SHEET, RESIN SHEET LAMINATE, CURED MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING SAME, MULTILAYER RESIN SHEET WITH METAL FOIL, AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL CO LTD (JP) 2020-10-28 EP disclosed
EP-2692759-B1 RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET LAMINATE, CURED RESIN SHEET LAMINATE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR DEVICE, AND LED DEVICE HITACHI CHEMICAL CO LTD (JP) 2018-10-31 EP disclosed
EP-3015487-B1 RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET STRUCTURE, CURED RESIN SHEET STRUCTURE, METHOD FOR PRODUCING CURED RESIN SHEET STRUCTURE, SEMICONDUCTOR DEVICE, AND LED DEVICE HITACHI CHEMICAL CO LTD (JP) 2018-04-04 EP disclosed
US-20180009979-A1 RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2018-01-11 US disclosed
US-9745411-B2 Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device HITACHI CHEMICAL COMPANY, LTD. (JP) 2017-08-29 US disclosed
US-20160177024-A1 RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET STRUCTURE, CURED RESIN SHEET STRUCTURE, METHOD FOR PRODUCING CURED RESIN SHEET STRUCTURE, SEMICONDUCTOR DEVICE, AND LED DEVICE HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-06-23 US disclosed
US-9349931-B2 Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-05-24 US disclosed
US-20040171788-A1 Main chain type liquid crystal polyester, liquid crystalline composition, method for producing liquid crystal film, optical film and display NOBLE VENTURE FINANCE I LIMITED (GB) 2004-09-02 US disclosed
US-20040158023-A1 Halogen-free resin composition CHANG CHUN PLASTICS CO., LTD. (TW) 2004-08-12 US disclosed
US-20040147640-A1 Halogen-free resin composition CHANG CHUN PLASTICS CO., LTD. (TW) 2004-07-29 US disclosed
EP-1422255-A1 MAIN CHAIN TYPE LIQUID CRYSTAL POLYESTER LIQUID CRYSTALLINE COMPOSITION METHOD FOR PRODUCING LIQUID CRYSTAL FILM OPTICAL FILM AND DISPLAY Nippon Oil Corporation (JP) 2004-05-26 EP disclosed
US-20040077821-A1 Flame retarding resin composition CHANG CHUN PLASTICS CO., LTD. (TW) 2004-04-22 US disclosed
US-20040044168-A1 Phosphorus- and nitrogen-containing resin hardener and a flame retarding resin composition containing said hardener CHANG CHUN PLASTICS CO., LTD. (TW) 2004-03-04 US disclosed
US-6617028-B1 Oxaphosphophenanthranene-substituted melamines or diaminotriazines; epoxy resins CHANG CHUN PLASTICS CO., LTD. (TW) 2003-09-09 US disclosed
US-6576690-B1 Pendant groups; improved processability and fireproofing; semiconductor encapsulating material CHANG CHUNG PLASTICS CO., LTD. (TW) 2003-06-10 US disclosed
JP-H08253555-A EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND SEMICONDUCTOR DEVICE SEALED THEREWITH TORAY IND INC 1996-10-01 JP disclosed
JP-H0563114-A RESIN COMPOSITION FOR SEALING SEMICONDUCTOR SUMITOMO BAKELITE CO LTD 1993-03-12 JP disclosed