SCHEMBL7576096

SCHEMBL7576096

Oc1ccc(Cc2ccc(OCC3CO3)cc2)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.56
ALDH1A1 P00352 4/20 0.53
TP53 P04637 3/20 0.53
TSHR P16473 3/20 0.53
HIF1A Q16665 3/20 0.53
MAPT P10636 2/20 0.53
HPGD P15428 2/20 0.53
MEN1 O00255 2/20 0.53
KMT2A Q03164 2/20 0.53
PKM P14618 2/20 0.53
CYP1A2 P05177 2/20 0.53
LMNA P02545 2/20 0.53
PPARG P37231 1/20 0.53
GAA P10253 1/20 0.53
PTPN1 P18031 1/20 0.53
CYP3A4 P08684 1/20 0.50
SMN1; SMN2 Q16637 1/20 0.50
ESR1 P03372 1/20 0.47
ESR2 Q92731 1/20 0.47
MGLL Q99685 2/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2446420 0.91 TDP1 (0.66) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL17902752 0.91 TDP1 (0.66) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL15246816 0.91 TDP1 (0.66) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL194748 0.91 TDP1 (0.66) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL16527790 0.91 TDP1 (0.66) TDP1ALDH1A1TP53TSHRHIF1A
Ethane SCHEMBL4436620 0.88 ALDH1A1 (0.62) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL17826371 0.87 TDP1 (0.56) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL9226245 0.86 TDP1 (0.59) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL2449724 0.86 TDP1 (0.59) TDP1ALDH1A1TP53TSHRHIF1A
SCHEMBL8467225 0.85 TDP1 (0.73) TDP1ALDH1A1TP53TSHRHIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024127878-A1 SIZING AGENT FOR FIBERS AND USE THEREOF 松本油脂製薬株式会社 2024-06-20 WO disclosed
US-20170198085-A1 POLYURETHANE-MODIFIED EPOXY RESIN, METHOD FOR PRODUCING SAME, EPOXY RESIN COMPOSITION AND CURED PRODUCT NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) 2017-07-13 US disclosed
EP-3153535-A1 POLYURETHANE-MODIFIED EPOXY RESIN, METHOD FOR PRODUCING SAME, EPOXY RESIN COMPOSITION AND CURED PRODUCT Nippon Steel & Sumikin Chemical Co., Ltd. (JP) 2017-04-12 EP disclosed
US-20160370615-A1 LIQUID CRYSTAL GRATING, METHOD OF MANUFACTURING THE SAME AND DISPLAY APPARATUS BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2016-12-22 US disclosed
US-9490043-B2 Highly conductive electrically conductive adhesives GEORGIA TECH RESEARCH CORPORATION (US) 2016-11-08 US disclosed
EP-2960245-A1 EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR MANUFACTURING SAME, COMPOSITION AND CURED PRODUCT INCLUDING SAME, AND USE THEREOF Korea Institute of Industrial Technology (KR) 2015-12-30 EP disclosed
US-20140360396-A1 LITHOGRAPHIC PRINTING PLATE PRECURSORS AND PROCESSES FOR PREPARING LITHOGRAPHIC PRINTING PLATES FUJIFILM CORPORATION (JP) 2014-12-11 US disclosed
US-20140360396-A1 LITHOGRAPHIC PRINTING PLATE PRECURSORS AND PROCESSES FOR PREPARING LITHOGRAPHIC PRINTING PLATES FUJIFILM CORPORATION (JP) 2014-12-11 US disclosed
US-20110240917-A1 BLUE PHASE LIQUID CRYSTAL COMPOSITION SONY CORPORATION (JP) 2011-10-06 US disclosed
US-20100323147-A1 ANISOTROPIC CONDUCTIVE FILM SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2010-12-23 US disclosed
US-20100244279-A1 Liquid resin composition for underfill, flip-chip mounted body and method for manufacturing the same NAMICS CORPORATION (JP) 2010-09-30 US disclosed
EP-0635528-B1 Epoxy-modified polyamide resin HITACHI CHEMICAL CO LTD (JP) 2002-09-18 EP disclosed
US-5874518-A Epoxy-modified polyamide resin HITACHI CHEMICAL COMPANY, LTD. (JP) 1999-02-23 US disclosed
EP-0635528-A2 Epoxy-modified polyamide resin Hitachi Chemical Co., Ltd. (JP) 1995-01-25 EP disclosed