SCHEMBL24569707

SCHEMBL24569707

O=C1OC(=O)N2CCCCC12

nearest known ligand 0.49

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
PLA2G7 Q13093 1/20 0.49
FKBP4 Q02790 3/20 0.40
ALDH1A1 P00352 3/20 0.35
MAPT P10636 3/20 0.33
CYP2C19 P33261 2/20 0.33
TSHR P16473 1/20 0.32
MEN1 O00255 2/20 0.32
KMT2A Q03164 2/20 0.32
BRCA1 P38398 1/20 0.32
ATM Q13315 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
GAA P10253 2/20 0.31
KDM4E B2RXH2 1/20 0.31
CYP2D6 P10635 1/20 0.31
PARP1 P09874 1/20 0.31
HPGD P15428 1/20 0.30
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8844037 0.94 PLA2G7 (0.54) PLA2G7FKBP4ALDH1A1MAPTCYP2C19
SCHEMBL6036453 0.94 PLA2G7 (0.54) PLA2G7FKBP4ALDH1A1MAPTCYP2C19
SCHEMBL6843148 0.85
SCHEMBL6849347 0.85
SCHEMBL6847858 0.85
SCHEMBL12443432 0.69 FKBP4 (0.48) FKBP4MAPTCYP2C19TSHRCYP2D6
SCHEMBL11751933 0.64 ALDH1A1 (0.38) ALDH1A1MAPTTSHRKMT2AKDM4E
SCHEMBL3322085 0.64 ALDH1A1 (0.50) ALDH1A1MAPTMEN1KMT2AGAA
SCHEMBL21698102 0.63 TSHR (0.44) PLA2G7ALDH1A1MAPTCYP2C19TSHR
SCHEMBL18184291 0.63 TSHR (0.44) PLA2G7ALDH1A1MAPTCYP2C19TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119866352-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 日本化药株式会社 2025-04-22 CN disclosed
CN-116813824-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-09-29 CN disclosed
CN-113348079-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-06-02 CN disclosed
WO-2022136366-A1 NOVEL METHOD FOR SYNTHESIZING NCA COMPOUNDS ECOLE NATIONALE SUPERIEURE DE CHIMIE DE MONTPELLIER (ENSCM) (FR) 2022-06-30 WO disclosed