SCHEMBL24589219

SCHEMBL24589219

COc1cc(C(C)C(C)c2cc(I)c(O)c(OC)c2)cc(I)c1O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ APP P05067 1/20 0.45
▸ LMNA P02545 1/20 0.41
▸ RPS6KA3 P51812 1/20 0.41
▸ AMY1A P0DUB6 2/20 0.38
▸ IGF1R P08069 1/20 0.38
▸ TTR P02766 1/20 0.38
▸ TRPV1 Q8NER1 2/20 0.38
▸ ALOX5 P09917 2/20 0.37
▸ CA12 O43570 1/20 0.37
▸ CA1 P00915 1/20 0.37
▸ CA2 P00918 1/20 0.37
▸ CA3 P07451 1/20 0.37
▸ PKM P14618 1/20 0.37
▸ CA4 P22748 1/20 0.37
▸ CA6 P23280 1/20 0.37
▸ CA5A P35218 1/20 0.37
▸ CA7 P43166 1/20 0.37
▸ CA9 Q16790 1/20 0.37
▸ CA14 Q9ULX7 1/20 0.37
▸ CA5B Q9Y2D0 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16271257 0.89 APP (0.45) APPLMNARPS6KA3AMY1AIGF1R
SCHEMBL24106144 0.87 APP (0.44) APPLMNARPS6KA3AMY1AIGF1R
SCHEMBL29695995 0.87 APP (0.44) APPLMNARPS6KA3AMY1AIGF1R
SCHEMBL29695951 0.85 APP (0.43) APPLMNARPS6KA3AMY1AIGF1R
SCHEMBL24589109 0.85 APP (0.43) APPLMNARPS6KA3AMY1AIGF1R
SCHEMBL24589185 0.85 APP (0.43) APPLMNARPS6KA3AMY1AIGF1R
SCHEMBL26857708 0.84 APP (0.42) APPLMNARPS6KA3AMY1AIGF1R
SCHEMBL24589119 0.77 LMNA (0.40) APPLMNARPS6KA3AMY1AIGF1R
SCHEMBL24110788 0.75 ALOX5 (0.57) APPLMNARPS6KA3AMY1AIGF1R
SCHEMBL27280320 0.75 TTR (0.64) APPLMNARPS6KA3AMY1AIGF1R

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022138670-A1 COMPOUND, POLYMER, COMPOSITION, FILM-FORMING COMPOSITION, PATTERN FORMATION METHOD, METHOD FOR FORMING INSULATING FILMS, AND COMPOUND PRODUCTION METHOD 三菱瓦斯化学株式会社 2022-06-30 — — WO disclosed
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