SCHEMBL24714976

SCHEMBL24714976

CCC(C)(CC(O)COc1ccc(OC(C)C(C)C2CO2)cc1)Oc1ccc(OCC2CO2)cc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.42
TP53 P04637 3/20 0.42
TSHR P16473 3/20 0.42
HPGD P15428 3/20 0.42
MEN1 O00255 3/20 0.42
ALDH1A1 P00352 3/20 0.42
HIF1A Q16665 3/20 0.42
MAPT P10636 2/20 0.42
CYP1A2 P05177 1/20 0.42
PPARG P37231 1/20 0.42
TDP1 Q9NUW8 1/20 0.35
PKM P14618 2/20 0.34
LMNA P02545 1/20 0.34
GAA P10253 1/20 0.34
CYP3A4 P08684 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
MAPK1 P28482 1/20 0.30
ABCB1 P08183 1/20 0.30
RECQL P46063 1/20 0.30
HTT P42858 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17011978 0.85 TP53 (0.45) KMT2ATP53TSHRHPGDMEN1
SCHEMBL25747789 0.82 KMT2A (0.56) KMT2ATP53TSHRHPGDMEN1
SCHEMBL11920239 0.82 ALDH1A1 (0.56) KMT2ATP53TSHRHPGDMEN1
SCHEMBL18844745 0.82 MEN1 (0.42) KMT2ATP53TSHRHPGDMEN1
SCHEMBL25835032 0.82 TP53 (0.42) KMT2ATP53TSHRHPGDMEN1
SCHEMBL23837201 0.81 KMT2A (0.55) KMT2ATP53TSHRHPGDMEN1
SCHEMBL24742917 0.80 ALDH1A1 (0.54) KMT2ATP53TSHRHPGDMEN1
SCHEMBL25917990 0.80 MEN1 (0.40) KMT2ATP53TSHRHPGDMEN1
SCHEMBL18087501 0.80 ALDH1A1 (0.54) KMT2ATP53TSHRHPGDMEN1
SCHEMBL20244248 0.80 ALDH1A1 (0.53) KMT2ATP53TSHRHPGDMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022255231-A1 MODIFIED EPOXY RESIN, RESIN COMPOSITION, CURED PRODUCT, LAMINATE FOR ELECTRIC/ELECTRONIC CIRCUITS, AND MODIFIED EPOXY RESIN PRODUCTION METHOD 日鉄ケミカル&マテリアル株式会社 2022-12-08 WO disclosed