SCHEMBL24747017

SCHEMBL24747017

Cc1cc(C(=O)NS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)cc(C(F)(F)F)c1

nearest known ligand 0.41

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CA1 P00915 8/20 0.41
CA2 P00918 8/20 0.41
MMP1 P03956 6/20 0.41
MMP2 P08253 6/20 0.41
MMP9 P14780 6/20 0.41
MMP8 P22894 6/20 0.41
MMP13 P45452 6/20 0.41
ADCY8 P40145 3/20 0.40
ADCY1 Q08828 3/20 0.40
AKT1 P31749 2/20 0.38
HDAC3 O15379 2/20 0.37
HDAC6 Q9UBN7 2/20 0.37
HDAC8 Q9BY41 2/20 0.37
KCNK3 O14649 1/20 0.37
KCNK9 Q9NPC2 1/20 0.37
GAA P10253 1/20 0.37
HDAC1 Q13547 1/20 0.36
HDAC2 Q92769 1/20 0.36
CES2 O00748 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24747018 0.90 CA1 (0.47) CA1CA2MMP1MMP2MMP9
SCHEMBL30646263 0.89 CA1 (0.46) CA1CA2MMP1MMP2MMP9
SCHEMBL26451948 0.81 HDAC8 (0.43) HDAC3HDAC6HDAC8GAAHDAC1
SCHEMBL23808368 0.78 HDAC8 (0.43) CA1CA2HDAC3HDAC6HDAC8
SCHEMBL25699500 0.78 LMNA (0.36) CA1CA2MMP1MMP2MMP9
SCHEMBL25795128 0.75 AKT1 (0.50) ADCY8ADCY1AKT1HDAC3HDAC6
SCHEMBL24845356 0.75 HDAC8 (0.41) CA1CA2MMP1MMP2MMP9
SCHEMBL15726944 0.71 ADCY8 (0.46) ADCY8ADCY1AKT1HDAC3HDAC6
SCHEMBL13754241 0.70 POLB (0.49) ADCY8ADCY1AKT1KCNK3KCNK9
SCHEMBL16261254 0.70 NPSR1 (0.63) ADCY8ADCY1AKT1HDAC8KCNK3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4106024-A1 METHOD FOR PREPARATION OF A P-TYPE SEMICONDUCTING LAYER, P-TYPE SEMICONDUCTING LAYER OBTAINED BY SAID METHOD, ORGANIC ELECTRONIC DEVICE COMPRISING THE P-TYPE SEMICONDUCTING LAYER, DISPLAY DEVICE COMPRISING THE ORGANIC ELECTRONIC DEVICE, METAL COMPOUND AND USE OF SAID METAL COMPOUND FOR THE P-TYPE SEMICONDUCTING LAYER Novaled GmbH (DE) 2022-12-21 EP disclosed