SCHEMBL2476597

SCHEMBL2476597

O=S(=O)(OCCc1ccccc1)c1ccccc1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 6/20 0.63
CA2 P00918 6/20 0.63
CA9 Q16790 3/20 0.63
CA12 O43570 2/20 0.49
CA7 P43166 2/20 0.49
ALDH1A1 P00352 2/20 0.44
PARL Q9H300 1/20 0.43
HTR6 P50406 1/20 0.43
CA13 Q8N1Q1 1/20 0.42
HTR2A P28223 2/20 0.41
KCNH2 Q12809 2/20 0.41
MEN1 O00255 1/20 0.41
TSHR P16473 1/20 0.41
KMT2A Q03164 1/20 0.41
HTR2C P28335 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
KEAP1 Q14145 1/20 0.41
CYP1A2 P05177 1/20 0.41
CYP2C9 P11712 1/20 0.41
CYP2C19 P33261 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9153277 0.89 CA2 (0.50) CA1CA2CA9CA12CA7
SCHEMBL241683 0.88 CA9 (0.54) CA1CA2CA9CA12CA7
SCHEMBL8000921 0.86 TDP1 (0.56) CA1CA2CA9CA12CA7
SCHEMBL10805799 0.86 CA2 (0.53) CA1CA2CA9CA12CA7
SCHEMBL3449015 0.85 PARL (0.50) CA1CA2CA9CA12CA7
SCHEMBL24510112 0.84 PTGS2 (0.51) CA1CA2CA9ALDH1A1MEN1
SCHEMBL7594590 0.84 CA1 (0.50) CA1CA2CA9CA12CA7
SCHEMBL9833127 0.81 CA1 (0.51) CA1CA2CA9CA12CA7
SCHEMBL9216761 0.81 CYP1A2 (0.46) CA1CA2CA9CA12KMT2A
SCHEMBL14778910 0.81 PARL (0.47) CA1CA2CA9CA12CA7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6326122-B1 HEAT SENSITIVE ELEMENTS MITSUBISHI CHEMICAL CORPORATION (JP) 2001-12-04 US claimed
CN-111324008-B Photosensitive composition and application thereof 乐凯华光印刷科技有限公司 2023-04-14 CN disclosed
CN-111324008-A Photosensitive composition and application thereof 乐凯华光印刷科技有限公司 2020-06-23 CN disclosed
CN-111138463-A Organic electroluminescent device and polycyclic compound for organic electroluminescent device 三星显示有限公司 2020-05-12 CN disclosed
CN-110531584-A A kind of UV-CTP photoresists and its preparation and test method HEBEI JINRUIMEI TECH CO LTD 2019-12-03 CN disclosed
CN-110461887-A Cured film is formed with composition, orientation material and phase difference material NISSAN CHEMICAL CORP 2019-11-15 CN disclosed
CN-110461965-A Cured film is formed with composition, orientation material and phase difference material NISSAN CHEMICAL CORP 2019-11-15 CN disclosed
CN-105051133-B Composition for forming cured film, alignment material, and phase difference material 日产化学工业株式会社 2018-08-28 CN disclosed
CN-108285439-A A kind of 2 inhibitor of carbon glycoside class sodium glucose transporter body 江苏天士力帝益药业有限公司 2018-07-17 CN disclosed
CN-105492535-B Composition for forming cured film, alignment material, and phase difference material 日产化学工业株式会社 2018-03-16 CN disclosed
US-6808861-B1 SUITABLE FOR DIRECT PLATE MAKING BY MEANS OF A SEMICONDUCTOR LASER OR A YAG LASER MITSUBISHI CHEMICAL CORPORATION (JP) 2004-10-26 US disclosed
EP-1464487-A2 Positive photosensitive composition and positive photosensitive lithographic printing plate Mitsubishi Chemical Corporation (JP) 2004-10-06 EP disclosed
US-20030224293-A1 Thin film comprising an organic compound dye that can form pits when irradiated with a semiconductor laser beam and an indole-2-vinylene metallocene compound ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2003-12-04 US disclosed
EP-0937703-B1 METHOD FOR PURIFYING PYRUVIC ACID COMPOUNDS SUMITOMO CHEMICAL CO (JP) 2003-05-21 EP disclosed
US-20020146635-A1 Positive photosensitive composition positive photosensitive lithographic printing plate and method for making positive photosensitive lithographic printing plate MITSUBISHI CHEMICAL CORPORATION (JP) 2002-10-10 US disclosed
US-6410207-B1 USING ALKALI DEVELOPER MITSUBISHI CHEMICAL CORPORATION (JP) 2002-06-25 US disclosed
US-6348617-B1 REACTING PYRUVIC ACID COMPOUND IN WATER WITH AMMONIUM OR ALKALI METAL BISULFITE TO GIVE AQUEOUS SOLUTION OF BISULFITE ADDUCT, ISOLATING BY PHASE SEPARATION, OPTIONALLY USING HYDROPHOBIC SOLVENT, CONTACTING WITH ACID TO DECOMPOSE ADDUCT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2002-02-19 US disclosed
US-6326122-B1 HEAT SENSITIVE ELEMENTS MITSUBISHI CHEMICAL CORPORATION (JP) 2001-12-04 US disclosed
EP-0937703-A1 METHOD FOR PURIFYING PYRUVIC ACID COMPOUNDS SUMITOMO CHEMICAL COMPANY LIMITED (JP) 1999-08-25 EP disclosed
EP-0823327-A2 Positive photosensitive composition, positive photosensitive lithographic printing plate and method for making positive photosensitive lithographic printing plate Mitsubishi Chemical Corporation (JP) 1998-02-11 EP disclosed