SCHEMBL24786205

SCHEMBL24786205

O=NC(=O)C(CC(=O)O)NC(=O)C1CCCCC1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.42
CASP3 P42574 4/20 0.42
PADI1 Q9ULC6 1/20 0.41
PADI4 Q9UM07 1/20 0.41
LMNA P02545 2/20 0.41
GAA P10253 1/20 0.41
HDAC8 Q9BY41 1/20 0.39
HDAC6 Q9UBN7 1/20 0.39
ITGB3 P05106 1/20 0.38
ITGA2B P08514 1/20 0.38
F2R P25116 1/20 0.38
EPHX1 P07099 1/20 0.38
CTSV O60911 2/20 0.37
CTSL P07711 2/20 0.37
CTSS P25774 2/20 0.37
CTSK P43235 1/20 0.37
CHRNB2 P17787 4/20 0.36
CHRNB4 P30926 4/20 0.36
CHRNA3 P32297 4/20 0.36
CHRNA4 P43681 4/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7898517 0.83 MME (0.46) SMN1; SMN2CASP3PADI1PADI4LMNA
SCHEMBL23967395 0.83 MME (0.46) SMN1; SMN2CASP3PADI1PADI4LMNA
SCHEMBL28910144 0.82 MME (0.45) SMN1; SMN2CASP3PADI1PADI4LMNA
SCHEMBL5209318 0.81 SMN1; SMN2 (0.47) SMN1; SMN2CASP3PADI1PADI4LMNA
SCHEMBL25206156 0.74 LMNA (0.47) CASP3LMNAGAA
SCHEMBL25206154 0.74 LMNA (0.47) CASP3LMNAGAA
SCHEMBL2797000 0.71 HDAC8 (0.45) PADI1PADI4LMNAHDAC8HDAC6
SCHEMBL2795524 0.71 HDAC8 (0.45) PADI1PADI4LMNAHDAC8HDAC6
SCHEMBL2794690 0.71 HDAC8 (0.45) PADI1PADI4LMNAHDAC8HDAC6
SCHEMBL7901558 0.71 FOLH1 (0.55) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022265042-A1 NUCLEATING AGENT COMPOSITION, RESIN COMPOSITION, MOLDED ARTICLE THEREOF, AND METHOD FOR MANUFACTURING RESIN COMPOSITION 株式会社ADEKA 2022-12-22 WO disclosed