SCHEMBL2483181

SCHEMBL2483181

Cc1cccc2c1nnn2CN(C(C)O)C(C)O

nearest known ligand 0.43

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
GRM2 Q14416 12/20 0.43
NPSR1 Q6W5P4 1/20 0.39
GPR139 Q6DWJ6 2/20 0.37
NPC1 O15118 2/20 0.36
RAB9A P51151 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
APAF1 O14727 1/20 0.33
POLB P06746 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL974763 0.88 GRM2 (0.46) GRM2NPSR1GPR139NPC1
SCHEMBL10956553 0.80 GRM2 (0.45) GRM2NPC1
SCHEMBL4233106 0.78 GRM2 (0.49) GRM2NPSR1NPC1
SCHEMBL975383 0.78 GRM2 (0.46) GRM2NPC1
SCHEMBL513590 0.78 SLC9A1 (0.56) GRM2NPSR1NPC1RAB9ASMN1; SMN2
SCHEMBL974069 0.77 GRM2 (0.40) GRM2NPSR1GPR139NPC1SMN1; SMN2
SCHEMBL19700841 0.77 GRM2 (0.41) GRM2NPSR1GPR139NPC1SMN1; SMN2
SCHEMBL19911462 0.77 GRM2 (0.47) GRM2GPR139NPC1
SCHEMBL21184979 0.76 GRM2 (0.42) GRM2NPSR1GPR139
SCHEMBL4218372 0.75 NPSR1 (0.51) GRM2NPSR1GPR139NPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9486892-B2 Polishing composition FUJIMI INCORPORATED (JP) 2016-11-08 US claimed
US-8864860-B2 Polishing composition FUJIMI INCORPORATED (JP) 2014-10-21 US claimed
US-20250189895-A1 METHOD OF MANUFACTURING PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-12 US disclosed
WO-2025105122-A1 METHOD FOR MANUFACTURING MODIFIED SUBSTRATE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND KIT 富士フイルム株式会社 2025-05-22 WO disclosed
US-11992914-B2 Polishing composition, polishing method, and method for producing substrate FUJIMI INCORPORATED (JP) 2024-05-28 US disclosed
WO-2023162551-A1 METHOD FOR PRODUCING PLATED SHAPED ARTICLE 東京応化工業株式会社 2023-08-31 WO disclosed
CN-114995059-A Resin, resist composition, and method for producing resist pattern 住友化学株式会社 2022-09-02 CN disclosed
CN-110045013-B Acoustic wave sensor and method of sensing gas phase analytes 罗门哈斯电子材料有限责任公司 2022-08-26 CN disclosed
CN-106019832-B Resin, resist composition, and method for producing resist pattern 住友化学株式会社 2022-07-01 CN disclosed
US-11339310-B2 Polishing composition FUJIMI INCORPORATED 2022-05-24 US disclosed
CN-114364780-A Treatment liquid, kit, method for producing treatment liquid, method for cleaning substrate, and method for treating substrate 富士胶片株式会社 2022-04-15 CN disclosed
EP-2693459-A1 POLISHING COMPOSITION AND POLISHING METHOD Fujimi Incorporated (JP) 2014-02-05 EP disclosed
US-20140014872-A1 POLISHING COMPOSITION AND POLISHING METHOD FUJIMI INCORPORATED (JP) 2014-01-16 US disclosed
US-20130203254-A1 POLISHING COMPOSITION AND POLISHING METHOD FUJIMI INCORPORATED (JP) 2013-08-08 US disclosed
EP-2605270-A1 POLISHING COMPOSITION AND POLISHING METHOD Fujimi Incorporated (JP) 2013-06-19 EP disclosed
US-20120153218-A1 POLISHING COMPOSITION FUJIMI INCORPORATED (JP) 2012-06-21 US disclosed
US-20110250754-A1 Polishing Composition and Polishing Method FIJIMI INCORPORATED (JP) 2011-10-13 US disclosed
EP-2374852-A1 Polishing composition and polishing method FUJIMI INCORPORATED (JP) 2011-10-12 EP disclosed
US-20090179172-A1 POLISHING COMPOSITION FUJIMI INCORPORATED (JP) 2009-07-16 US disclosed
US-20090173910-A1 POLISHING COMPOSITION FUJIMI INCORPORATED (JP) 2009-07-09 US disclosed