Trifluoromethanesulfonic Acid

Trifluoromethanesulfonic Acid

SCHEMBL2483807

CC(C)(C)c1ccccc1I.O=S(=O)(O)C(F)(F)F

nearest known ligand 0.44

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.44
ALDH1A1 P00352 1/20 0.44
TDP1 Q9NUW8 1/20 0.44
HSD11B1 P28845 4/20 0.41
CA2 P00918 2/20 0.36
MEN1 O00255 2/20 0.34
KMT2A Q03164 2/20 0.34
RBP4 P02753 1/20 0.33
PTPN1 P18031 1/20 0.33
CA1 P00915 1/20 0.33
CA5A P35218 1/20 0.33
CA9 Q16790 1/20 0.33
GABRA1 P14867 1/20 0.32
GABRB2 P47870 1/20 0.32
SLC22A12 Q96S37 1/20 0.32
PTPN5 P54829 1/20 0.32
CYP1A2 P05177 1/20 0.32
CYP3A4 P08684 1/20 0.32
CYP2D6 P10635 1/20 0.32
CYP2C19 P33261 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Trifluoromethanesulfonic Acid SCHEMBL7535106 1.00 TSHR (0.44) TSHRALDH1A1TDP1HSD11B1CA2
Trifluoromethanesulfonic Acid SCHEMBL8736614 0.87 ALDH1A1 (0.39) TSHRALDH1A1TDP1HSD11B1CA2
Trifluoromethanesulfonic Acid SCHEMBL2228760 0.85 MEN1 (0.40) TSHRALDH1A1HSD11B1CA2MEN1
Trifluoromethanesulfonic Acid SCHEMBL1286190 0.85 CA2 (0.37) TSHRALDH1A1TDP1HSD11B1CA2
SCHEMBL5826443 0.84 HSD11B1 (0.39) TSHRALDH1A1TDP1HSD11B1CA2
SCHEMBL28681870 0.83 CA2 (0.38) TSHRALDH1A1TDP1HSD11B1CA2
Trifluoromethanesulfonic Acid SCHEMBL8736613 0.83 PTPN1 (0.39) TSHRALDH1A1TDP1HSD11B1CA2
SCHEMBL5826458 0.83 CA2 (0.38) TSHRALDH1A1TDP1HSD11B1CA2
Trifluoromethanesulfonic Acid SCHEMBL10667371 0.82 PTPN1 (0.33) ALDH1A1HSD11B1CA2MEN1KMT2A
SCHEMBL4424690 0.81 TSHR (0.55) TSHRALDH1A1TDP1HSD11B1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7153630-B2 Resist with reduced line edge roughness MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) 2006-12-26 US claimed
US-20060078820-A1 Resist with reduced line edge roughness MASS INSTITUTE OF TECHNOLOGY (MIT) (US) 2006-04-13 US claimed
EP-0990625-B1 Vinyl ether-based optical fiber coatings LUCENT TECHNOLOGIES INC (US) 2003-12-10 EP claimed
US-20030036015-A1 Resist with reduced line edge roughness AIR FORCE, UNITED STATES 2003-02-20 US claimed
WO-2002091084-A2 RESIST WITH REDUCED LINE EDGE ROUGHNESS MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) 2002-11-14 WO claimed
EP-0990625-A1 Vinyl ether-based optical fiber coatings Lucent Technologies Inc. (US) 2000-04-05 EP claimed
EP-1653285-B1 Evaluation method of resist composition using immersion solvent TOKYO OHKA KOGYO CO LTD (JP) 2015-05-27 EP disclosed
US-8198004-B2 Resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2012-06-12 US disclosed
EP-1653284-B1 Evaluation method of resist composition based on sensitivity TOKYO OHKA KOGYO CO LTD (JP) 2011-11-02 EP disclosed
EP-1589375-B1 RESIST COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2011-10-19 EP disclosed
US-7541138-B2 Resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2009-06-02 US disclosed
US-20090130605-A1 RESIST COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2009-05-21 US disclosed
US-7527909-B2 Evaluation of suitability of a resist composition as a positive or negative resist composition used in a resist pattern formation method involving an immersion exposure step, which is resistant to the deleterious effects of the solvent used; excellent sensitivity and resist pattern profile TOKYO OHKA KOGYO CO., LTD. (JP) 2009-05-05 US disclosed
EP-1653284-A2 Evaluation method of resist composition based on sensitivity TOKYO OHKA KOGYO CO., LTD. (JP) 2006-05-03 EP disclosed
EP-1653285-A2 Evaluation method of resist composition using immersion solvent TOKYO OHKA KOGYO CO., LTD. (JP) 2006-05-03 EP disclosed
EP-1610178-A1 RESIST COMPOSITION FOR LIQUID IMMERSION EXPOSURE PROCESS AND METHOD OF FORMING RESIST PATTERN THEREWITH TOKYO OHKA KOGYO CO., LTD. (JP) 2005-12-28 EP disclosed
EP-1596251-A1 IMMERSION EXPOSURE PROCESS-USE RESIST PROTECTION FILM FORMING MATERIAL, COMPOSITE FILM, AND RESIST PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2005-11-16 EP disclosed
EP-1589375-A1 RESIST COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2005-10-26 EP disclosed
US-20050014090-A1 immersion lithography; sensitivity; using mixture of (meth0acrylate ester and acid generator TOKYO OHKA KOGYO CO., LTD. 2005-01-20 US disclosed
US-20020015906-A1 Polymer for photoresist, method of production thereof and photoresist composition containing polymer SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-02-07 US disclosed