SCHEMBL248942

SCHEMBL248942

CCOC(CN)C([SiH3])(OCC)OCC

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL550904 0.82 THRB (0.33) THRB
SCHEMBL8841148 0.78 THRB (0.31) THRB
SCHEMBL3900493 0.78 THRB (0.31) THRB
SCHEMBL28007565 0.78 THRB (0.31) THRB
SCHEMBL1664369 0.78 THRB (0.31) THRB
SCHEMBL441658 0.76 THRB (0.32) THRB
SCHEMBL2392860 0.75
SCHEMBL27796097 0.74
SCHEMBL14876249 0.74 OPRM1 (0.35)
SCHEMBL23530134 0.72 OPRM1 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114995058-B Resin precursor composition, polyimide resin film containing resin precursor composition and application of polyimide resin film 吉林奥来德光电材料股份有限公司 2025-05-06 CN claimed
CN-117563439-B Modified polytetrafluoroethylene film material and preparation method thereof 山东美氟科技股份有限公司 2024-03-19 CN claimed
CN-117563439-A Modified polytetrafluoroethylene film material and preparation method thereof 山东美氟科技股份有限公司 2024-02-20 CN claimed
CN-115010924-B Photosensitive polyimide resin composition, polyimide resin film containing photosensitive polyimide resin composition and application of photosensitive polyimide resin composition 吉林奥来德光电材料股份有限公司 2023-10-13 CN claimed
CN-115010924-A Photosensitive polyimide resin composition, polyimide resin film containing same and application of polyimide resin film 吉林奥来德光电材料股份有限公司 2022-09-06 CN claimed
CN-114995058-A Resin precursor composition, polyimide resin film containing resin precursor composition and application of polyimide resin film 吉林奥来德光电材料股份有限公司 2022-09-02 CN claimed
WO-2014007782-A2 A NON-NEWTONIAN MATERIAL WITH SHOCK ABSORPTION PROPERTY KECELI ALPER (TR) 2014-01-09 WO claimed
CN-1313564-C Irradiant material with surface modification and activation MICROBE EPIDEMIC DISEASE INST (CN) 2007-05-02 CN claimed
US-20250092515-A1 SELECTIVE DEPOSITION OF MATERIAL COMPRISING SILICON AND OXYGEN USING PLASMA ASM IP HOLDING B.V. (NL) 2025-03-20 US disclosed
US-20250069883-A1 SELECTIVE DEPOSITION OF OXIDE MATERIAL AND A DEPOSITION ASSEMBLY ASM IP HOLDING B.V. (NL) 2025-02-27 US disclosed
CN-119506835-A Selective deposition of oxide materials and deposition assemblies ASM IP私人控股有限公司 2025-02-25 CN disclosed
US-12227835-B2 Selective deposition of material comprising silicon and oxygen using plasma ASM IP HOLDING B.V. (NL) 2025-02-18 US disclosed
CN-118662692-A Preparation method and application of HA/beta TCP (high-molecular-weight-control-fraction-transmission control) scaffold material containing nucleic acid aptamer 中国人民解放军陆军军医大学第一附属医院 2024-09-20 CN disclosed
CN-117563439-B Modified polytetrafluoroethylene film material and preparation method thereof 山东美氟科技股份有限公司 2024-03-19 CN disclosed
EP-0239620-A1 PRODUCTION OF AMINO ACIDS USING COUPLED AMINOTRANSFERASES GENETICS INSTITUTE, INC. (US) 1987-10-07 EP disclosed
EP-0234083-A2 Carrier for a biologically active component for immunoassay or enzymatic reaction TOSOH CORPORATION (JP) 1987-09-02 EP disclosed
WO-1987001727-A1 PRODUCTION OF AMINO ACIDS USING COUPLED AMINOTRANSFERASES GENETICS INSTITUTE, INC. (US) 1987-03-26 WO disclosed
US-4599243-A OXYGEN-BARRIER, PINHOLE-FREE, SEMICONDUCTORS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1986-07-08 US disclosed
US-4562091-A Use of plasma polymerized orgaosilicon films in fabrication of lift-off masks INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1985-12-31 US disclosed
US-4493855-A DEPOSITION OF ORGANOSILICON BARRIER, HEAT TREATMENT, DEPOSITION PHOTORESIST, ION ETCHING, AND DISSOLVING FIRST POLYMER INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1985-01-15 US disclosed