SCHEMBL24908561

SCHEMBL24908561

C=C(C)C(=O)OC(c1ccc(O)cc1)C(F)(F)F

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ESR1 P03372 12/20 0.43
▸ ESR2 Q92731 11/20 0.43
▸ CA12 O43570 2/20 0.34
▸ CA1 P00915 2/20 0.34
▸ CA2 P00918 2/20 0.34
▸ CA7 P43166 2/20 0.34
▸ CA9 Q16790 2/20 0.34
▸ CA14 Q9ULX7 2/20 0.34
▸ DEGS1 O15121 1/20 0.34
▸ SRC P12931 1/20 0.33
▸ PDCD1 Q15116 1/20 0.33
▸ CD274 Q9NZQ7 1/20 0.33
▸ ABHD6 Q9BV23 1/20 0.31
▸ LMNA P02545 1/20 0.31
▸ CYP1A2 P05177 1/20 0.31
▸ PGR P06401 1/20 0.31
▸ CHRM2 P08172 1/20 0.31
▸ CYP3A4 P08684 1/20 0.31
▸ ADORA3 P0DMS8 1/20 0.31
▸ AR P10275 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26862473 0.87 ESR1 (0.36) ESR1ESR2CA12CA1CA2
SCHEMBL5091135 0.86 HPGD (0.41) ESR1ESR2CYP3A4
SCHEMBL26861508 0.85 ESR1 (0.35) ESR1ESR2CA12CA1CA2
SCHEMBL26862661 0.85 CYP2C9 (0.38) ESR1ESR2CA12CA1CA2
SCHEMBL26862706 0.85 ESR1 (0.36) ESR1ESR2DEGS1TDP1
SCHEMBL26862708 0.85 MAPT (0.45) CA1CA2MAPTTDP1
SCHEMBL25765230 0.84 ESR1 (0.46) ESR1ESR2DEGS1PDCD1CD274
SCHEMBL26862746 0.84 CYP2C9 (0.40) ESR1ESR2CA12CA1CA2
SCHEMBL26862498 0.84 CA12 (0.36) CA12CA1CA2CA7CA9
SCHEMBL26871312 0.82 ACACB (0.41) LMNACYP1A2CYP3A4ADORA3CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230375925-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND RESIN FUJIFILM CORPORATION (JP) 2023-11-23 — — US disclosed
WO-2023157526-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, COMPOUND, AND RESIN 富士フイルム株式会社 2023-08-24 — — WO disclosed
WO-2023002869-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, RESIN, AND METHOD FOR PRODUCING RESIN 富士フイルム株式会社 2023-01-26 — — WO disclosed
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