SCHEMBL26862746

SCHEMBL26862746

C=C(C)C(=O)OC(c1ccc2cc3ccc(O)cc3cc2c1)C(F)(F)F

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CYP2C9 P11712 1/20 0.40
▸ HSD17B10 Q99714 1/20 0.40
▸ KCNJ11 Q14654 1/20 0.33
▸ ESR1 P03372 4/20 0.32
▸ ESR2 Q92731 2/20 0.32
▸ KMT2A Q03164 6/20 0.32
▸ MEN1 O00255 5/20 0.32
▸ CASP3 P42574 2/20 0.32
▸ SENP8 Q96LD8 2/20 0.32
▸ SENP7 Q9BQF6 2/20 0.32
▸ SENP6 Q9GZR1 2/20 0.32
▸ NPC1 O15118 1/20 0.32
▸ ABHD6 Q9BV23 1/20 0.32
▸ TPH1 P17752 2/20 0.32
▸ CA12 O43570 1/20 0.31
▸ CA1 P00915 1/20 0.31
▸ CA2 P00918 1/20 0.31
▸ CA7 P43166 1/20 0.31
▸ CA9 Q16790 1/20 0.31
▸ CA14 Q9ULX7 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26862661 0.96 CYP2C9 (0.38) CYP2C9HSD17B10KCNJ11ESR1ESR2
SCHEMBL24908561 0.84 ESR1 (0.43) CYP2C9ESR1ESR2ABHD6CA12
SCHEMBL26861550 0.82 CYP2C9 (0.40) CYP2C9HSD17B10KMT2AMEN1CASP3
SCHEMBL26862498 0.80 CA12 (0.36) HSD17B10KMT2AMEN1CA12CA1
SCHEMBL26862696 0.79 AKR1B1 (0.35) HSD17B10KMT2AMEN1TPH1KDM4E
SCHEMBL26862662 0.78 HSD17B1 (0.38) KCNJ11ESR1ESR2TPH1
SCHEMBL24908564 0.78 SHBG (0.38) HSD17B10ESR1ESR2CA12CA1
SCHEMBL26861535 0.78 CYP2C9 (0.38) CYP2C9HSD17B10ESR1ESR2KMT2A
SCHEMBL26794326 0.77 APP (0.34) HSD17B10CA12CA1CA2CA7
SCHEMBL24908563 0.76 TSHR (0.48) KMT2AMEN1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230375925-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND RESIN FUJIFILM CORPORATION (JP) 2023-11-23 — — US disclosed
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