SCHEMBL2491247

SCHEMBL2491247

O=C1C=CC(=O)N1c1ccc(Oc2ccc(OC(Oc3ccc(Oc4ccc(N5C(=O)C=CC5=O)cc4)cc3)(C(F)(F)F)C(F)(F)F)cc2)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 14/20 0.60
HSP90AA1 P07900 4/20 0.50
PKM P14618 2/20 0.50
ALDH1A1 P00352 2/20 0.50
LMNA P02545 2/20 0.50
CCR6 P51684 2/20 0.50
MEN1 O00255 1/20 0.50
HPGD P15428 1/20 0.50
HTT P42858 1/20 0.50
KMT2A Q03164 1/20 0.50
ATM Q13315 1/20 0.50
FAAH O00519 5/20 0.48
TDP1 Q9NUW8 2/20 0.42
MAPK1 P28482 1/20 0.42
NPSR1 Q6W5P4 1/20 0.42
DDAH1 O94760 1/20 0.39
BCHE P06276 1/20 0.38
CACNA1B Q00975 1/20 0.38
APBA1 Q02410 1/20 0.38
APOBEC3G Q9HC16 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4385482 0.82 MGLL (0.84) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL487033 0.82 MGLL (0.84) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL331752 0.82 MGLL (0.84) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL3006629 0.81 MGLL (0.58) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL94319 0.81 MGLL (0.60) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL10297376 0.78 MGLL (0.57) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL28596008 0.78 MGLL (0.57) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL9578196 0.77 MGLL (0.60) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL9578406 0.77 MGLL (0.60) MGLLHSP90AA1PKMALDH1A1LMNA
SCHEMBL9852605 0.77 MGLL (0.55) MGLLHSP90AA1PKMALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8029911-B2 Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-10-04 US disclosed
US-20100294551-A1 ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING THE SAME, AND CIRCUIT CONNECTED STRUCTURE NOMURA SATOYUKI 2010-11-25 US disclosed
US-20070166549-A1 Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure NOMURA SATOYUKI 2007-07-19 US disclosed
US-7208105-B2 Mixture of electroconductive particles and polymer HITACHI CHEMICAL CO., LTD. (JP) 2007-04-24 US disclosed
US-20030141014-A1 Mixture of electroconductive particles and polymer HITACHI CHEMICAL CO., LTD. (JP) 2003-07-31 US disclosed