SCHEMBL2492249

SCHEMBL2492249

CCC(C[SiH](OC)OC)Nc1ccccc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 3/20 0.39
ALDH1A1 P00352 5/20 0.35
CYP3A4 P08684 3/20 0.35
ALOX15 P16050 3/20 0.35
TSHR P16473 3/20 0.35
HSD17B10 Q99714 3/20 0.35
THRB P10828 2/20 0.35
L3MBTL1 Q9Y468 2/20 0.35
ALOX12 P18054 2/20 0.35
LMNA P02545 2/20 0.35
RECQL P46063 1/20 0.35
ATM Q13315 1/20 0.35
HIF1A Q16665 2/20 0.34
TP53 P04637 1/20 0.34
HSP90AA1 P07900 1/20 0.34
CASP1 P29466 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
MAPK1 P28482 1/20 0.34
TACR1 P25103 1/20 0.33
KCNH3 Q9ULD8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28547088 0.87 TDP1 (0.37) TDP1ALDH1A1CYP3A4ALOX15TSHR
SCHEMBL2795065 0.85 TDP1 (0.38) TDP1ALDH1A1CYP3A4ALOX15TSHR
SCHEMBL2495982 0.79 TDP1 (0.54) TDP1ALDH1A1CYP3A4ALOX15TSHR
Methane SCHEMBL28523284 0.77 TDP1 (0.52) TDP1ALDH1A1CYP3A4ALOX15TSHR
Hydrochloric Acid SCHEMBL17710412 0.77 TDP1 (0.52) TDP1ALDH1A1CYP3A4ALOX15TSHR
SCHEMBL632881 0.77 MAPT (0.47) TDP1ALDH1A1CYP3A4ALOX15TSHR
SCHEMBL9572932 0.72 TDP1 (0.46) TDP1ALDH1A1CYP3A4ALOX15TSHR
SCHEMBL2937099 0.72 KCNH3 (0.54) TDP1ALDH1A1CYP3A4ALOX15TSHR
SCHEMBL20362192 0.72 KCNH3 (0.54) TDP1ALDH1A1CYP3A4ALOX15TSHR
SCHEMBL809501 0.72 ALDH1A1 (0.61) TDP1ALDH1A1CYP3A4ALOX15TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110591158-A Modified core-shell type aluminum oxide and polyurethane composite material, and preparation method and application thereof 浙江华峰新材料股份有限公司 2019-12-20 CN claimed
WO-2025121410-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE パナソニックIPマネジメント株式会社 2025-06-12 WO disclosed
WO-2025110106-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE パナソニックIPマネジメント株式会社 2025-05-30 WO disclosed
WO-2025110104-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE パナソニックIPマネジメント株式会社 2025-05-30 WO disclosed
EP-4555030-A1 PROTECTION COATING COMPOSITION, TREATING METHOD USING THE SAME AND ARTICLE THEREOF Henkel AG & Co. KGaA (DE) 2025-05-21 EP disclosed
EP-4555023-A1 CORROSION PROTECTION PRETREATMENT AGENT, TREATING METHOD USING THE SAME AND ARTICLE THEREOF Henkel AG & Co. KGaA (DE) 2025-05-21 EP disclosed
US-20250145853-A1 PROTECTION COATING COMPOSITION, TREATING METHOD USING THE SAME AND ARTICLE THEREOF HENKEL AG & CO. KGAA (DE) 2025-05-08 US disclosed
US-20250146139-A1 CORROSION PROTECTION PRETREATMENT AGENT, TREATING METHOD USING THE SAME AND ARTICLE THEREOF HENKEL AG & CO. KGAA (DE) 2025-05-08 US disclosed
WO-2025075176-A1 POLYMER, CURABLE RESIN COMPOSITION, CURED RESIN ARTICLE, ADHESIVE COMPOSITION, ADHESIVE FILM, AND ADHESIVE SHEET 株式会社レゾナック 2025-04-10 WO disclosed
WO-2024204091-A1 LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE パナソニックIPマネジメント株式会社 2024-10-03 WO disclosed
WO-2020026757-A1 ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 日立化成株式会社 2020-02-06 WO disclosed
US-20190030863-A1 IONOMER INTERLAYER WITH ENHANCED ADHESION PROPERTIES KURARAY AMERICA, INC. (US) 2019-01-31 US disclosed
EP-3077468-B1 A METHOD FOR COATING AN AGED COATING LAYER ON A SUBSTRATE, AND A COATING COMPOSITION SUITABLE FOR USE IN THIS METHOD AKZO NOBEL COATINGS INT BV (NL) 2018-02-28 EP disclosed
US-20170051159-A1 A Method for Coating an Aged Coating Layer on a Substrate, and a Coating Composition Suitable for Use in This Method AKZO NOBEL COATINGS INTERNATIONAL B.V. (NL) 2017-02-23 US disclosed
US-20160083634-A1 CURABLE COMPOSITION AND JOINT STRUCTURE PRODUCED USING SAME SEKISUI FULLER COMPANY, LTD. (JP) 2016-03-24 US disclosed
US-8232355-B2 Liquid resin composition for electronic components and electronic component device HITACHI CHEMICAL CO., LTD. (JP) 2012-07-31 US disclosed
EP-2364241-A2 HYDROPHILIC AND HYDROPHOBIC SILANE SURFACE MODIFICATION OF ABRASIVE GRAINS Saint-Gobain Abrasives, Inc. (US) 2011-09-14 EP disclosed
US-20090286930-A1 Liquid Resin Composition for Electronic Components and Electronic Component Device RESONAC CORPORATION (JP) 2009-11-19 US disclosed
WO-2009129384-A2 HYDROPHILIC AND HYDROPHOBIC SILANE SURFACE MODIFICATION OF ABRASIVE GRAINS SAINT-GOBAIN ABRASIVES, INC. (US) 2009-10-22 WO disclosed
EP-0370464-A2 Curable resin composition Kanegafuchi Chemical Industry Co., Ltd. (JP) 1990-05-30 EP disclosed