SCHEMBL2493875

SCHEMBL2493875

O=C(O)C1(C(=O)O)C=CCCCC1

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
AKR1C1 Q04828 1/20 0.33
CYP2C19 P33261 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28622777 0.98 CYP2C19 (0.34) AKR1C1CYP2C19
SCHEMBL2498312 0.98 CYP2C19 (0.34) AKR1C1CYP2C19
SCHEMBL17024323 0.98 CYP2C19 (0.34) AKR1C1CYP2C19
SCHEMBL17024325 0.98 CYP2C19 (0.34) AKR1C1CYP2C19
SCHEMBL16732080 0.98 CYP2C19 (0.34) AKR1C1CYP2C19
Hydrochloric Acid SCHEMBL4184748 0.96 CYP2C19 (0.33) AKR1C1CYP2C19
SCHEMBL203079 0.93 AKR1C1 (0.30) AKR1C1
Bromide SCHEMBL689745 0.91
Hydrochloric Acid SCHEMBL689891 0.91
Acetic Acid SCHEMBL27533339 0.87 CYP3A4 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 98 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12583977-B2 Block polymer, thermoplastic resin composition and molded article SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2026-03-24 US disclosed
US-12516139-B2 Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-01-06 US disclosed
EP-4321541-B1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2025-08-06 EP disclosed
CN-116406387-B Block polymer, thermoplastic resin composition, and molded article 三洋化成工业株式会社 2025-06-13 CN disclosed
CN-119866352-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 日本化药株式会社 2025-04-22 CN disclosed
US-12221523-B2 Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-02-11 US disclosed
CN-117529509-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2025-01-10 CN disclosed
EP-4074740-B1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2024-11-20 EP disclosed
CN-117355545-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-10-18 CN disclosed
US-20240309127-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-09-19 US disclosed
US-20150240011-A1 PRODUCTION METHOD FOR SOLID CATALYST COMPONENT FOR POLYMERIZING OLEFINS, CATALYST FOR POLYMERIZING OLEFINS, AND PRODUCTION METHOD FOR POLYMERIZED OLEFINS TOHO TITANIUM CO., LTD. (JP) 2015-08-27 US disclosed
US-20150166693-A1 METHOD FOR PRODUCING SOLID CATALYST COMPONENT FOR USE IN POLYMERIZATION OF OLEFIN, CATALYST FOR USE IN POLYMERIZATION OF OLEFIN, AND METHOD FOR PRODUCING OLEFIN POLYMER TOHO TITANIUM CO., LTD. (JP) 2015-06-18 US disclosed
EP-2876118-A1 METHOD FOR PRODUCING SOLID CATALYST COMPONENT FOR USE IN POLYMERIZATION OF OLEFIN, CATALYST FOR USE IN POLYMERIZATION OF OLEFIN, AND METHOD FOR PRODUCING OLEFIN POLYMER Toho Titanium CO., LTD. (JP) 2015-05-27 EP disclosed
EP-2644630-A1 MODIFIER FOR POLYOLEFIN RESIN Sanyo Chemical Industries, Ltd. (JP) 2013-10-02 EP disclosed
US-20130244010-A1 MODIFIER FOR POLYOLEFIN RESIN SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2013-09-19 US disclosed
EP-1642931-B1 EMULSION COMPOSITION OF MODIFIED POLYPROPYLENE TONEN SEKIYUKAGAKU KK (JP) 2011-10-05 EP disclosed
US-7211618-B2 Paint composition for in-mold coating of thermoplastic plastic substrates and its uses NIPPON BEE CHEMICAL CO., LTD. (JP) 2007-05-01 US disclosed
US-20070004847-A1 Emulsion composition of modified polypropylene TONEN CHEMICAL CORPORATION (JP) 2007-01-04 US disclosed
EP-1642931-A1 EMULSION COMPOSITION OF MODIFIED POLYPROPYLENE Tonen Chemical Corporation (JP) 2006-04-05 EP disclosed
US-20050131130-A1 Paint composition for in-mold coating of thermoplastic plastic substrates and its uses NIPPON BEE CHEMICAL CO., LTD. 2005-06-16 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12583977-B2 Block polymer, thermoplastic resin composition and molded article MACF1, PUF60, SMC4 AKR1C1 543/4885CYP2C19 4716/4885
US-20070004847-A1 Emulsion composition of modified polypropylene POLD1, DDHD2, POP1 AKR1C1 3751/4885CYP2C19 1038/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.